公开(公告)号：US20240290683A1

公开(公告)日：2024-08-29

申请号：US18114362

申请日：2023-02-27

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Wen-Yi LIN ,  Kuang-Chun LEE ,  Chien-Chen LI ,  Chien-Li KUO ,  Kuo-Chio LIU

IPC分类号： H01L23/373 ,  H01L21/48 ,  H01L23/053 ,  H01L23/367

CPC分类号： H01L23/3732 ,  H01L21/4871 ,  H01L23/053 ,  H01L23/3672 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253

摘要： An embodiment semiconductor package structure may include a package substrate, a semiconductor die coupled to the package substrate, and a package lid attached to the package substrate and covering the semiconductor die. The package lid may include a top portion having a spatially varying thermal conductivity that is greater in a first region than in a second region. The first region may include a multi-layer structure including a metal/diamond composite material supported by a copper layer. The metal/diamond composite material may include a silver/diamond, copper/diamond, or aluminum/diamond material and may have a thermal conductivity that is within a range from 600 W/m·K to 900 W/m·K and a coefficient of thermal expansion that is in a second range from 5 ppm/° C. to 10 ppm/° C. The package lid may have an effective coefficient of thermal expansion that is in a range from 14.5 ppm/° C. to 17 ppm/° C.

公开(公告)号：US20220415773A1

公开(公告)日：2022-12-29

申请号：US17721499

申请日：2022-04-15

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Wen-Yi LIN ,  Kuang-Chun Lee ,  Chien-Chen Li ,  Chen-Shien Chen

IPC分类号： H01L23/498 ,  H01L21/48

摘要： A substrate for a semiconductor package includes an array of bonding pads on a first surface of the substrate, and a plurality of raised structures adjacent to at least some of the bonding pads on the first surface of the substrate. The raised structures may be configured to control the height of solder balls contacting the array of bonding pads when the package substrate is mounted onto a support substrate. The raised structures may compensate for a deformation of the package substrate so that the co-planarity of the solder balls may be improved, thereby providing an improved solder connection between the package substrate and the support substrate.