公开(公告)号：US20230045361A1

公开(公告)日：2023-02-09

申请号：US17572371

申请日：2022-01-10

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Ming-Cheng HSU ,  Wen-Chun Tu

IPC分类号： G01R1/073

摘要： A probe assembly includes a multilayer structure including probe contact pads, an upper guide plate including an array of upper holes therethrough, a lower guide plate including an array of lower holes therethrough, a vertical stack of a plurality of dielectric spacer plates located between the upper guide plate and the lower guide plate and including a respective opening therethrough, and an array of probes attached to the probe contact pads, vertically extending through the array of upper holes and the array of lower holes, and vertically extending through the openings through the vertical stack of the plurality of dielectric spacer plates.