专利检索 ap:("Takashi Aoki" OR "Takashi Masuda" OR "Hideki Tanaka" OR "Ichiro Yudasaka") AND inv:"Ichiro Yudasaka" 第 1 页

1.

发明申请
Method of manufacturing a wiring substrate, method of manufacturing an electro-optical device, method of manufacturing an electronic apparatus 失效

公开(公告)号：US20060037935A1

公开(公告)日：2006-02-23

申请号：US11200162

申请日：2005-08-10

申请人： Takashi Aoki , Takashi Masuda , Hideki Tanaka , Ichiro Yudasaka

发明人： Takashi Aoki , Takashi Masuda , Hideki Tanaka , Ichiro Yudasaka

IPC分类号： H01B13/00 , B29D11/00

CPC分类号： H01L21/32139 , G02B6/43 , H01L21/28123 , H01L27/1292 , H05K3/061 , H05K2203/013

摘要： An etching method of the invention includes arranging droplets including a film-forming material on a substrate, drying each of the droplets to form a dry film having a width smaller than the diameter of each droplet at the time of the arrangement, and performing etching while using the dry film as an etching protective film.