Molding resin and process for production thereof
    1.
    发明授权
    Molding resin and process for production thereof 有权
    成型树脂及其制造方法

    公开(公告)号:US07169882B2

    公开(公告)日:2007-01-30

    申请号:US10508954

    申请日:2003-08-19

    IPC分类号: C08G63/00

    摘要: A molding resin formed from a block copolymer comprising polyhydroxycarboxylic acid structural units (I), and polyester structural units (II) derived from a dicarboxylic acid and a diol; wherein the weight ratio (I)/(II) between the polyhydroxycarboxylic acid structural units (I) and the polyester structural units (II) is within a range from 95/5 to 10/90; the resin has a microphase separated structure in which either the polyhydroxycarboxylic acid structural units (I) or the polyester structural units (II) forms domains within a matrix formed by the other structural units; the average domain size of the domains is within a range from 0.08 to 5.0 μm; and the weight average molecular weight of the molding resin is within a range from 10,000 to 400,000.

    摘要翻译: 由包含聚羟基羧酸结构单元(I)和由二羧酸和二醇衍生的聚酯结构单元(II)的嵌段共聚物形成的模制树脂; 其中聚羟基羧酸结构单元(I)和聚酯结构单元(II)之间的重量比(I)/(II)在95/5至10/90的范围内; 所述树脂具有微相分离结构,其中所述多羟基羧酸结构单元(I)或所述聚酯结构单元(II)在由其它结构单元形成的基质内形成结构域; 域的平均域大小在0.08至5.0μm的范围内; 成型树脂的重均分子量在10,000〜400,000的范围内。

    Molding resin and process for production thereof
    3.
    发明申请
    Molding resin and process for production thereof 有权
    成型树脂及其制造方法

    公开(公告)号:US20060030690A1

    公开(公告)日:2006-02-09

    申请号:US10508954

    申请日:2003-08-19

    IPC分类号: C08G63/02

    摘要: A molding resin formed from a block copolymer comprising polyhydroxycarboxylic acid structural units (I), and polyester structural units (II) derived from a dicarboxylic acid and a diol; wherein the weight ratio (I)/(II) between the polyhydroxycarboxylic acid structural units (I) and the polyester structural units (II) is within a range from 95/5 to 10/90; the resin has a microphase separated structure in which either the polyhydroxycarboxylic acid structural units (I) or the polyester structural units (II) forms domains within a matrix formed by the other structural units; the average domain size of the domains is within a range from 0.08 to 5.0 μm; and the weight average molecular weight of the molding resin is within a range from 10,000 to 400,000.

    摘要翻译: 由包含聚羟基羧酸结构单元(I)和由二羧酸和二醇衍生的聚酯结构单元(II)的嵌段共聚物形成的模制树脂; 其中聚羟基羧酸结构单元(I)和聚酯结构单元(II)之间的重量比(I)/(II)在95/5至10/90的范围内; 所述树脂具有微相分离结构,其中所述多羟基羧酸结构单元(I)或所述聚酯结构单元(II)在由其它结构单元形成的基质内形成结构域; 域的平均域大小在0.08至5.0μm的范围内; 成型树脂的重均分子量在10,000〜400,000的范围内。