公开(公告)号：US20070069644A1

公开(公告)日：2007-03-29

申请号：US11468452

申请日：2006-08-30

申请人： Takayuki TAJIMA ,  Hiroyuki TATSUGI ,  Takanori TAKESHITA

发明人： Takayuki TAJIMA ,  Hiroyuki TATSUGI ,  Takanori TAKESHITA

IPC分类号： H01J1/62

CPC分类号： B41J2/451 ,  H01L51/5246 ,  H01L2251/566

摘要： There is provided a light-emitting apparatus formed by attaching a device substrate where light-emitting device is formed and a sealing substrate which seals the device substrate through a sealing material and sealing the light-emitting device between the device substrate and the sealing substrate through the sealing material, wherein the sealing material includes a first sealing material and a second sealing material, wherein the first sealing material is formed to surround the light-emitting device between the device substrate and the sealing substrate and to have a sealing hole portion formed by not disposing the first sealing material, so that the first sealing material is discontinuous, wherein the sealing hole portion of the first sealing material is closed with the second sealing material, so that the second sealing material and the first sealing material constitute a ring-shaped sealing member, and wherein the first sealing material is provided with guide portions which are formed to be continuous with at least one side where the sealing hole portion is formed and to extend to an inner surface of the device substrate without being covered with the sealing substrate so as to be exposed.

摘要翻译： 提供了一种发光装置，其通过附着形成发光装置的器件基板和通过密封材料密封器件基板的密封基板而形成，并且将发光器件密封在器件基板和密封基板之间，通过 密封材料，其中所述密封材料包括第一密封材料和第二密封材料，其中所述第一密封材料形成为围绕所述器件基板和所述密封基板之间的发光器件，并且具有由 不设置第一密封材料，使得第一密封材料不连续，其中第一密封材料的密封孔部分用第二密封材料封闭，使得第二密封材料和第一密封材料构成环形 密封构件，并且其中所述第一密封材料设置有用于的引导部分 使其与形成有密封孔部的至少一侧连续并且延伸到装置基板的内表面而不被密封基板覆盖以露出。

公开(公告)号：US20120231625A1

公开(公告)日：2012-09-13

申请号：US13414454

申请日：2012-03-07

申请人： Takayuki TAJIMA ,  Akira Tojo

发明人： Takayuki TAJIMA ,  Akira Tojo

IPC分类号： H01L21/768

CPC分类号： H01L23/53238 ,  H01L21/76802 ,  H01L21/7684 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming wiring of a semiconductor device includes: forming an insulating resin on a main surface of a substrate such that an opening portion defining a wiring pattern is provided in the insulating resin; forming a first wiring layer made of a first metal on a bottom surface and side surfaces of the opening portion surrounding and a surface of the insulating resin opposite to the main surface of the substrate, the first wiring layer having a bottom portion formed on the bottom surface of the opening portion and side portions formed on the side surfaces, the bottom portion having a thickness greater than a thickness of at least one of the side portions; and cutting the insulating resin and the first wiring layer such that the insulating resin and the first wiring layer are exposed.

摘要翻译： 形成半导体器件布线的方法包括：在绝缘树脂中设置绝缘树脂至基片的主表面上，使得限定布线图形的开口部分; 在底面上形成由第一金属构成的第一布线层和围绕的开口部分的侧表面和与基板的主表面相对的绝缘树脂的表面，第一布线层的底部形成在底部 所述开口部的表面和形成在所述侧面上的侧部，所述底部的厚度大于所述侧部中的至少一个的厚度; 以及绝缘树脂和第一布线层的切割，使得绝缘树脂和第一布线层露出。