Plasma method and apparatus for processing a substrate
    1.
    发明授权
    Plasma method and apparatus for processing a substrate 有权
    用于处理衬底的等离子体方法和设备

    公开(公告)号:US06831021B2

    公开(公告)日:2004-12-14

    申请号:US10461083

    申请日:2003-06-12

    IPC分类号: H01L21469

    摘要: Embodiments of the invention generally provide a method of forming a nitride gate dielectric layer. The method includes generating a nitrogen-containing plasma in a processing chamber via introduction of a nitrogen-containing processing gas into the processing chamber and the application of an ionizing energy to the processing gas, and pulsing the ionizing energy to maintain a mean temperature of electrons in the nitrogen-containing plasma of less than about 0.7 eV.

    摘要翻译: 本发明的实施例通常提供形成氮化物栅极电介质层的方法。 该方法包括通过在处理室中引入含氮处理气体和向处理气体中施加电离能,并且使电离能脉冲以维持电子的平均温度,从而在处理室中产生含氮等离子体 在含氮等离子体中小于约0.7eV。