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公开(公告)号：US20200341038A1
公开(公告)日：2020-10-29
申请号：US16685582
申请日：2019-11-15
申请人： Tegam, Inc.
IPC分类号： G01R21/02 , H01R24/42 , H01P3/00 , H01P1/26 , H05K1/18 , H05K3/30 , H01C17/00 , H01C7/00 , H05K1/02
摘要： A coaxial power sensor assembly configured to provide a broadband matched termination utilizing coplanar waveguide topology while simultaneously providing a source of heat energy for a surface mount chip thermistor element to measure applied input power. The coaxial thermal power sensor is comprised of a thin film resistive device on a dielectric substrate and a surface mount chip thermistor element placed in close planar proximity to the resistive device in order to maximize the heat flux via a closely coupled thermal path to the thermistor and alter the bias current through the resistance to be measured. The power sensor is intended to function from DC to 70 GHz, but the same should not be construed as a limitation.
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公开(公告)号：US20210116479A1
公开(公告)日：2021-04-22
申请号：US16658467
申请日：2019-10-21
申请人： Tegam, Inc.
发明人： Jefferson D. Lexa
摘要： An in-line suspended non-directional power sensor coupling configuration situated within a high frequency transmission line housing that allows non-directional current and sampling voltage elements to all be produced simultaneously on one or more double sided printed circuit boards (PCB). The power sensor coupling allows for repeatable calibrated coupling responses across a much wider frequency range with a single PCB assembly, as opposed to the need to cover equivalently sized frequency ranges with multiple individually fabricated coupling element assemblies.
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公开(公告)号：US11422172B2
公开(公告)日：2022-08-23
申请号：US16685582
申请日：2019-11-15
申请人： Tegam, Inc.
IPC分类号： G01R21/02 , H01R24/42 , H01P3/00 , H01P1/26 , H05K1/18 , H01C17/00 , H01C7/00 , H05K1/02 , H05K3/30
摘要： A coaxial power sensor assembly configured to provide a broadband matched termination utilizing coplanar waveguide topology while simultaneously providing a source of heat energy for a surface mount chip thermistor element to measure applied input power. The coaxial thermal power sensor is comprised of a thin film resistive device on a dielectric substrate and a surface mount chip thermistor element placed in close planar proximity to the resistive device in order to maximize the heat flux via a closely coupled thermal path to the thermistor and alter the bias current through the resistance to be measured. The power sensor is intended to function from DC to 70 GHz, but the same should not be construed as a limitation.
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公开(公告)号：US11333686B2
公开(公告)日：2022-05-17
申请号：US16658467
申请日：2019-10-21
申请人： Tegam, Inc.
发明人： Jefferson D. Lexa
摘要： An in-line suspended non-directional power sensor coupling configuration situated within a high frequency transmission line housing that allows non-directional current and sampling voltage elements to all be produced simultaneously on one or more double sided printed circuit boards (PCB). The power sensor coupling allows for repeatable calibrated coupling responses across a much wider frequency range with a single PCB assembly, as opposed to the need to cover equivalently sized frequency ranges with multiple individually fabricated coupling element assemblies.
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公开(公告)号：US10892533B2
公开(公告)日：2021-01-12
申请号：US16058153
申请日：2018-08-08
申请人： Tegam, Inc.
发明人： Jefferson D. Lexa
摘要： A power sensor system, assembly and method for use as a power sensor standard in the 50 to 75 GHz frequency range. The power sensing system comprises a housing comprising a dual ridged waveguide impedance transformer, and a resistive component attachable to a back side of the housing. The resistive component comprises a terminating element electrically, but not thermally isolated from a sensing element. The sensing element operates at a constant resistance and is perpendicularly oriented to the terminating element.
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公开(公告)号：US20200052358A1
公开(公告)日：2020-02-13
申请号：US16058153
申请日：2018-08-08
申请人： Tegam, Inc.
发明人： Jefferson D. Lexa
摘要： A power sensor system, assembly and method for use as a power sensor standard in the 50 to 75 GHz frequency range. The power sensing system comprises a housing comprising a dual ridged waveguide impedance transformer, and a resistive component attachable to a back side of the housing. The resistive component comprises a terminating element electrically, but not thermally isolated from a sensing element. The sensing element operates at a constant resistance and is perpendicularly oriented to the terminating element.
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