公开(公告)号：US10825848B2

公开(公告)日：2020-11-03

申请号：US14851943

申请日：2015-09-11

Applicant: Teledyne DALSA B.V. ,  Teledyne DALSA, Inc.

Inventor： Daniel Verbugt ,  Bryan Delodder

IPC: H01L27/146

Abstract: The disclosed embodiments include an image sensor and a method to manufacture thereof. In one embodiment, the method includes forming a plurality of semiconductor slices having a uniform width, at least two of the semiconductor slices having different lengths, and each of the semiconductor slices having a slice edge defining a side of the semiconductor slice. The method further includes arranging the semiconductor slices to form a semi-rectangular shape defining boundaries of the image sensor, each of the semiconductor slices being disposed proximate to another semiconductor slice of the plurality of semiconductor slices. Forming each semiconductor slice includes forming a plurality of pixel arrays over the semiconductor slice, the pixel arrays having an approximately uniform pixel pitch, and forming a seal ring around the semiconductor slice, the seal ring enclosing the semiconductor slice and the pixel arrays of the semiconductor slice, and each semiconductor slice having a different seal ring.

公开(公告)号：US20170077152A1

公开(公告)日：2017-03-16

申请号：US14851943

申请日：2015-09-11

Applicant: Teledyne DALSA B.V. ,  Teledyne DALSA, Inc.

Inventor： Daniel VERBUGT ,  Bryan Delodder

IPC: H01L27/146

Abstract: The disclosed embodiments include an image sensor and a method to manufacture thereof. In one embodiment, the method includes forming a plurality of semiconductor slices having a uniform width, at least two of the semiconductor slices having different lengths, and each of the semiconductor slices having a slice edge defining a side of the semiconductor slice. The method further includes arranging the semiconductor slices to form a semi-rectangular shape defining boundaries of the image sensor, each of the semiconductor slices being disposed proximate to another semiconductor slice of the plurality of semiconductor slices. Forming each semiconductor slice includes forming a plurality of pixel arrays over the semiconductor slice, the pixel arrays having an approximately uniform pixel pitch, and forming a seal ring around the semiconductor slice, the seal ring enclosing the semiconductor slice and the pixel arrays of the semiconductor slice, and each semiconductor slice having a different seal ring.

Abstract translation: 所公开的实施例包括图像传感器及其制造方法。 在一个实施例中，该方法包括形成具有均匀宽度的多个半导体薄片，至少两个半导体薄片具有不同的长度，并且每个半导体薄片具有限定半导体薄片的一侧的切片边缘。 该方法还包括布置半导体薄片以形成限定图像传感器边界的半矩形形状，每个半导体薄片被设置在多个半导体薄片的另一个半导体薄片附近。 形成每个半导体薄片包括在半导体薄片上形成多个像素阵列，像素阵列具有大致均匀的像素间距，以及在半导体薄片周围形成密封环，密封环包围半导体薄片和半导体的像素阵列 切片，并且每个半导体切片具有不同的密封环。