Platen assembly utilizing magnetic slip ring
    1.
    发明申请
    Platen assembly utilizing magnetic slip ring 审中-公开
    使用磁滑环的压板组件

    公开(公告)号:US20060154569A1

    公开(公告)日:2006-07-13

    申请号:US11034350

    申请日:2005-01-11

    IPC分类号: B24B49/00

    摘要: Embodiments of the present invention generally relate to an apparatus for processing a substrate and more specifically to a device that will transfer electrical power and/or control signals between a stationary base and a rotating platen without involving mechanical contact. The device does not suffer the drawbacks of conventional slip rings burdened with moving surfaces. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a planarizing material and disposed on a stationary base so that the platen assembly may rotate relative to the base. The apparatus further includes a coupling assembly for transferring electrical energy from a primary coil to a secondary coil. The coupling assembly includes the primary coil of wire wrapped around a first core; the first core coupled to the base; the secondary coil of wire wrapped around a second core; and the second core coupled to the platen assembly.

    摘要翻译: 本发明的实施例总体上涉及一种用于处理衬底的装置,更具体地涉及将在固定基座和旋转压板之间传递电力和/或控制信号而不涉及机械接触的装置。 该装置不会承受传统的滑动环带有移动表面的缺点。 在一个实施例中,提供了一种用于处理衬底的设备。 该装置包括压板组件,其具有用于支撑平坦化材料并设置在固定基座上的表面,使得压板组件可相对于底座旋转。 该装置还包括用于将电能从初级线圈传递到次级线圈的联接组件。 联接组件包括缠绕在第一芯上的线的初级线圈; 第一个核心耦合到基地; 线圈的二次线圈缠绕在第二芯上; 以及联接到压板组件的第二芯体。