公开(公告)号：US4601794A

公开(公告)日：1986-07-22

申请号：US647738

申请日：1984-09-06

申请人： Tetsuaki Tsuda ,  Kazuo Asano ,  Atsuyoshi Shibuya ,  Minoru Nishihara ,  Kenichi Yanagi ,  Mitsuo Kato ,  Katsuhiko Yamada ,  Teijiro Fujisaka

发明人： Tetsuaki Tsuda ,  Kazuo Asano ,  Atsuyoshi Shibuya ,  Minoru Nishihara ,  Kenichi Yanagi ,  Mitsuo Kato ,  Katsuhiko Yamada ,  Teijiro Fujisaka

IPC分类号： C25D21/10 ,  C25D5/08 ,  C25D7/06 ,  C25D17/00 ,  C25D5/04

CPC分类号： C25D7/0614 ,  C25D5/08

摘要： A method and apparatus of continuous electroplating of a strip with an alloy by passing the strip through a plating bath of the immersion type in both down-pass and up-pass with an anode being positioned in each pass so as to face at least one side of the strip are disclosed. Said anode is an insoluble anode which is spaced from the strip by a distance of about 10-50 mm, and the plating solution is blown into the gap between said anode and said strip countercurrently with respect to the movement of said strip.

摘要翻译： 一种用合金连续电镀条带的方法和装置，该方法和装置是通过将条带浸入浸入式电镀槽中的同时向下通过和向上通过，阳极定位在每个通道中，以便面对至少一个侧面 的条带。 所述阳极是不溶性阳极，其与条隔开约10-50mm的距离，并且电镀溶液相对于所述带的移动逆流地吹入所述阳极和所述带之间的间隙中。