公开(公告)号：US06442146B1

公开(公告)日：2002-08-27

申请号：US09075249

申请日：1998-05-11

申请人： Tetsuo Onodera ,  Hiroshi Usami ,  Akihiro Shibuya ,  Eimatsu Moriyama ,  Kiyoshi Hamaguchi ,  Yoichi Saito ,  Tadashi Matsumoto ,  Mitsuhiko Mizuno

发明人： Tetsuo Onodera ,  Hiroshi Usami ,  Akihiro Shibuya ,  Eimatsu Moriyama ,  Kiyoshi Hamaguchi ,  Yoichi Saito ,  Tadashi Matsumoto ,  Mitsuhiko Mizuno

IPC分类号： H04B7212

CPC分类号： H04B7/212

摘要： The present invention is directed to a TDMA communication system which is adapted to different communication environments or prepares different communication environments and allows each mobile station to be set for working in any one of the different communication environments. The communication system commonly uses a TDMA format that has a fixed frame-length and a constant number of bits for each of the slots composing the frame. The communication environments have prepared respective sets of communication conditions, each set including a transmission power, a modulating method, the number of multiplexed signals, error-correction, an antenna gain, a frequency hopping value and a diversity value. At each mobile station and each base station, one of plural sets of communication conditions for respective environments is selected to establish communication with each other under the selected environment.

摘要翻译： 本发明涉及适用于不同通信环境或准备不同通信环境的TDMA通信系统，并且允许每个移动站被设置用于在不同通信环境中的任何一个中工作。 通信系统通常使用对于构成帧的每个时隙具有固定的帧长度和固定比特数的TDMA格式。 通信环境已经准备好各种通信条件，每组包括传输功率，调制方法，多路复用信号的数量，纠错，天线增益，跳频值和分集值。 在每个移动站和每个基站处，选择用于各个环境的多组通信条件之一，以在所选择的环境下建立彼此的通信。

公开(公告)号：US07069045B2

公开(公告)日：2006-06-27

申请号：US10092249

申请日：2002-03-07

申请人： Gang Wu ,  Mitsuhiko Mizuno ,  Yoshihiro Hase ,  Paul J. M. Havinga

发明人： Gang Wu ,  Mitsuhiko Mizuno ,  Yoshihiro Hase ,  Paul J. M. Havinga

IPC分类号： H04B1/38 ,  H04M1/00 ,  H04Q7/20

CPC分类号： H04W92/12 ,  H04W36/28 ,  H04W48/18 ,  H04W88/06 ,  H04W88/16 ,  H04W92/14

摘要： To create a network that connects a plurality of wireless communication systems to create optimal systems for various environments, and that seamlessly integrates the resulting systems together in order to provide more efficient and advanced service in general. A network system that can seamlessly integrate wireless communication systems employs a heterogeneous network architecture with at least four building blocks, including a mobile host 40, a wireless access network 41, a common core network 42, and an external network 43.

摘要翻译： 为了创建连接多个无线通信系统以创建用于各种环境的最佳系统的网络，并且将所得到的系统无缝集成在一起，以便通常提供更有效和先进的服务。 可以无缝地集成无线通信系统的网络系统采用具有至少四个构建块的异构网络架构，包括移动主机40，无线接入网络41，公共核心网络42和外部网络43。

公开(公告)号：US08167629B2

公开(公告)日：2012-05-01

申请号：US12926537

申请日：2010-11-24

申请人： Dai Ito ,  Takayoshi Honda ,  Mitsuhiko Mizuno

发明人： Dai Ito ,  Takayoshi Honda ,  Mitsuhiko Mizuno

IPC分类号： H01R12/00

CPC分类号： H01R12/70

摘要： An electronic device has: a connector having plural kinds of terminals with respectively different cross section shapes; and a substrate having a plurality of through-holes with lands formed therein. In the electronic device, a width W1 of an insertion portion of the first terminal, a width W2 of an insertion portion of the second terminal, a land-inclusive hole diameter D1 of the first through-hole, and a land-inclusive hole diameter D2 of the second through-hole are configured to fulfill conditions of W1 D2−D1, for the improvement of connection reliability between the land and the terminal while restraining dropping of reflow solder in a connector mounting process.

摘要翻译： 电子装置具有：具有分别具有不同截面形状的多种端子的连接器; 以及具有多个通孔的基板，其中形成有焊盘。 在电子设备中，第一端子的插入部分的宽度W1，第二端子的插入部分的宽度W2，第一通孔的平台包含孔径D1和包含平台的孔直径 第二通孔的D2被配置为满足W1 D2-D1的条件，以提高焊盘与端子之间的连接可靠性，同时抑制回流焊料在 连接器安装过程。

公开(公告)号：US20110189870A1

公开(公告)日：2011-08-04

申请号：US12926537

申请日：2010-11-24

申请人： Dai Ito ,  Takayoshi Honda ,  Mitsuhiko Mizuno

发明人： Dai Ito ,  Takayoshi Honda ,  Mitsuhiko Mizuno

IPC分类号： H01R12/70

CPC分类号： H01R12/70

摘要： An electronic device has: a connector having plural kinds of terminals with respectively different cross section shapes; and a substrate having a plurality of through-holes with lands formed therein. In the electronic device, a width W1 of an insertion portion of the first terminal, a width W2 of an insertion portion of the second terminal, a land-inclusive hole diameter D1 of the first through-hole, and a land-inclusive hole diameter D2 of the second through-hole are configured to fulfill conditions of W1 D2−D1, for the improvement of connection reliability between the land and the terminal while restraining dropping of reflow solder in a connector mounting process.

摘要翻译： 电子装置具有：具有分别具有不同截面形状的多种端子的连接器; 以及具有多个通孔的基板，其中形成有焊盘。 在电子设备中，第一端子的插入部分的宽度W1，第二端子的插入部分的宽度W2，第一通孔的平台包含孔径D1和包含平台的孔直径 第二通孔的D2被配置为满足W1 D2-D1的条件，以提高焊盘和端子之间的连接可靠性，同时抑制回流焊料在 连接器安装过程。