公开(公告)号：US20240047316A1

公开(公告)日：2024-02-08

申请号：US17880057

申请日：2022-08-03

Applicant: Texas Instruments Incorporated

Inventor： Yiqi Tang ,  Rajen Murugan ,  Chittranjan Gupta

IPC: H01L23/495 ,  H05K1/18 ,  H05K1/11 ,  H01L23/00

CPC classification number: H01L23/49555 ,  H05K1/181 ,  H05K1/115 ,  H01L24/48 ,  H01L24/49 ,  H05K2201/10363 ,  H01L23/3107

Abstract: An electronic device includes conductive leads, a conductive crossbar, and first and second bond wires. The conductive leads are arranged in a row along a side of a package structure and include a conductive first lead, a conductive second lead, and a conductive third lead. The first and second leads are non-adjacent, the third lead is between the first and second leads in the row, and the crossbar electrically connects the first and second leads. The first bond wire electrically connects a first conductive feature of a semiconductor die to one of the crossbar, the first lead, and the second lead, and the second bond wire electrically connects a second conductive feature of the semiconductor die to the third lead.