公开(公告)号：US20230317662A1

公开(公告)日：2023-10-05

申请号：US17710348

申请日：2022-03-31

Applicant: Texas Instruments Incorporated

Inventor： Rafael Jose Guevara ,  Laura May Antionette Dela Paz Clemente ,  Amin Sijelmassi ,  Kashyap Mohan

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/29

CPC classification number: H01L24/16 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L23/3128 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/295 ,  H01L2924/35 ,  H01L2924/182 ,  H01L2224/1601 ,  H01L2224/16237 ,  H01L2224/16227 ,  H01L2224/17135 ,  H01L2224/11849 ,  H01L2224/13147 ,  H01L2224/13553 ,  H01L2224/1357 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/11013 ,  H01L2224/11019 ,  H01L2924/186

Abstract: An electronic device includes a substrate, a semiconductor die, and a molded package structure that encloses a portion of the semiconductor die and extends to a portion of the substrate. A sensor surface extends along a side of the semiconductor die, and conductive terminals extend outward from the side and have ends soldered to conductive features of the substrate. The side of the semiconductor die is spaced apart from the substrate and the conductive terminals forming a cage structure that laterally surrounds the sensor surface. The molded package structure has a cavity that extends between the sensor surface and the substrate, and the cavity extends in an interior of a cage structure formed by the conductive terminals.