公开(公告)号：US20150061081A1

公开(公告)日：2015-03-05

申请号：US14536897

申请日：2014-11-10

Applicant: Texas Instruments Incorporated

Inventor： Jeffrey Alan WEST ,  Thomas D. BONIFIELD ,  Basab CHATTERJEE

IPC: H01L23/00 ,  H01L23/58

CPC classification number: H01L23/562 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit containing a crack deflecting scribe seal which separates an interior region of the integrated circuit from a scribeline immediately outside the integrated circuit and a method of forming the same. The crack deflecting scribe seal includes continuous metal layers and continuous contacts and continuous vias between the continuous metal layers. The continuous metal layers do not extend past the continuous contacts and continuous vias. The continuous contacts and continuous vias are recessed from edges of the underlying continuous metal layers on the scribeline side of the scribe seal, providing an angled outer surface on the scribe seal which may desirably terminate crack propagation or deflect crack propagation upward to a top surface of the scribeline or the crack deflecting scribe seal.

Abstract translation: 一种集成电路，其包含将集成电路的内部区域与紧邻集成电路外部的划片线分隔开的裂纹偏转划线密封件及其形成方法。 裂纹偏转划线密封件包括连续金属层和连续金属层之间的连续接触和连续通孔。 连续金属层不延伸经过连续接触和连续通孔。 连续接触和连续的通孔从划线密封的划线侧的下面的连续金属层的边缘凹陷，在划线密封件上提供成角度的外表面，其可以期望地终止裂纹扩展或将裂纹传播向上偏转到顶部表面 划线或裂纹偏转划痕。

公开(公告)号：US20190188839A1

公开(公告)日：2019-06-20

申请号：US15847600

申请日：2017-12-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Elizabeth C. STEWART ,  Young Sawk OH ,  Zhiyi YU ,  Jeffrey A. WEST ,  Thomas D. BONIFIELD

IPC: G06T7/00

CPC classification number: G06T7/001 ,  G06T2207/30148

Abstract: A method comprises obtaining a wafer comprising a plurality of components, wherein each of the plurality of components exposes a first surface of the component present in a first focal plane and a second surface of the component present in a second focal plane. The method comprises generating, by an optical tool, a first image of the first surface and a second image of the second surface of one of the plurality of components. The method comprises comparing, by a processor, the first image with a first reference image to produce a first value and the second image with a second reference image to produce a second value. The method comprises generating, by the processor, a wafer map indicating a quality state of the one of the plurality of components based on the first and second values.