公开(公告)号：US06357022B1

公开(公告)日：2002-03-12

申请号：US09686044

申请日：2000-10-11

申请人： Thang Nguyen ,  Ngoc Le ,  Benjamin E. Chou

发明人： Thang Nguyen ,  Ngoc Le ,  Benjamin E. Chou

IPC分类号： H02H305

CPC分类号： G11C29/028 ,  G01R31/01 ,  G01R31/31713 ,  G01R31/31905 ,  G11C5/04 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5004 ,  H05K1/141

摘要： Memory modules such as SIMMs and DIMMs are automatically tested by a target-system motherboard such as a PC motherboard. An automated SIMM/DIMM handler is connected to a handler adaptor board that is mounted to the back or solder-side of the PC motherboard. The relatively flat surface of the solder-side of the PC motherboard allows close mounting of the handler. One or more of the SIMM sockets on the motherboard is removed to provide mounting holes for the handler adaptor board. The handler adaptor board provides electrical connection from the module-under-test (MUT) in the handler to the removed SIMM socket on the PC motherboard. The handler adaptor board provides a slight spacing or offset from the solder-side surface of the PC motherboard's substrate, allowing the handler to be plugged directly into tester-connectors on the handler adaptor board. Since the offset of the adaptor board is slight, the length of electrical connections to the handler is short, minimizing the load on the PC's memory bus. A handler controller card that controls the handler is plugged into the PCI or ISA bus on the PC motherboard. Power to the handler adaptor board is cut when a new module is moved into position in the handler, reducing memory-bus upset.

摘要翻译： 内存模块（如SIMM和DIMM）由目标系统主板（如PC主板）自动测试。 自动SIMM / DIMM处理器连接到安装到PC主板的背面或焊接侧的处理器适配器板。 PC主板的焊料侧的相对平坦的表面允许处理器的紧密安装。 卸下主板上的一个或多个SIMM插座，为处理器适配器板提供安装孔。 处理器适配器板提供从处理器中的测试模块（MUT）到PC主板上拆卸的SIMM插座的电气连接。 处理器适配器板提供与PC主板基板的焊料侧表面稍微间距或偏移，允许处理器直接插入处理器适配器板上的测试仪连接器。 由于适配器板的偏移量很小，与处理器的电气连接长度很短，从而使PC内存总线上的负载最小化。 控制处理程序的处理程序控制卡插入PC主板上的PCI或ISA总线。 当新模块移动到处理器中的位置时，处理器适配器板的电源被切断，从而减少内存总线烦扰。

公开(公告)号：US06178526B1

公开(公告)日：2001-01-23

申请号：US09056973

申请日：1998-04-08

申请人： Thang Nguyen ,  Ngoc Le ,  Benjamin E. Chou

发明人： Thang Nguyen ,  Ngoc Le ,  Benjamin E. Chou

IPC分类号： H02H305

CPC分类号： G11C29/028 ,  G01R31/01 ,  G01R31/31713 ,  G01R31/31905 ,  G11C5/04 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5004 ,  H05K1/141

摘要： Memory modules such as SIMMs and DIMMs are automatically tested by a target-system motherboard such as a PC motherboard. An automated SIMM/DIMM handler is connected to a handler adaptor board that is mounted to the back or solder-side of the PC motherboard. The relatively flat surface of the solder-side of the PC motherboard allows close mounting of the handler. One or more of the SIMM sockets on the motherboard is removed to provide mounting holes for the handler adaptor board. The handler adaptor board provides electrical connection from the module-under-test (MUT) in the handler to the removed SIMM socket on the PC motherboard. The handler adaptor board provides a slight spacing or offset from the solder-side surface of the PC motherboard's substrate, allowing the handler to be plugged directly into tester-connectors on the handler adaptor board. Since the offset of the adaptor board is slight, the length of electrical connections to the handler is short, minimizing the load on the PC's memory bus. A handler controller card that controls the handler is plugged into the PCI or ISA bus on the PC motherboard. Power to the handler adaptor board is cut when a new module is moved into position in the handler, reducing memory-bus upset.

摘要翻译： 内存模块（如SIMM和DIMM）由目标系统主板（如PC主板）自动测试。 自动SIMM / DIMM处理器连接到安装到PC主板的背面或焊接侧的处理器适配器板。 PC主板的焊料侧的相对平坦的表面允许处理器的紧密安装。 卸下主板上的一个或多个SIMM插座，为处理器适配器板提供安装孔。 处理器适配器板提供从处理器中的测试模块（MUT）到PC主板上拆卸的SIMM插座的电气连接。 处理器适配器板提供与PC主板基板的焊料侧表面稍微间距或偏移，允许处理器直接插入处理器适配器板上的测试仪连接器。 由于适配器板的偏移量很小，与处理器的电气连接长度很短，从而使PC内存总线上的负载最小化。 控制处理程序的处理程序控制卡插入PC主板上的PCI或ISA总线。 当新模块移动到处理器中的位置时，处理器适配器板的电源被切断，从而减少内存总线烦扰。

公开(公告)号：US5850526A

公开(公告)日：1998-12-15

申请号：US598156

申请日：1996-02-07

申请人： Benjamin E. Chou

发明人： Benjamin E. Chou

IPC分类号： G06F13/38 ,  H04L29/06 ,  G06F13/00

CPC分类号： G06F13/387 ,  H04L29/06 ,  H04L69/04

摘要： Data is compressed in an industry-standard local-area network (LAN) such as IEEE 802.2 or 802.3. Compression occurs at a low level, in the data link layer just above the physical layer. The data in the packet is compressed, but the source and destination addresses are not compressed. A type/length field which indicates the length of the data field is adjusted for the new compressed length, while a frame checksum which was calculated for the uncompressed data is re-generated for the compressed data. Thus the packet with the compressed data has the length and checksum adjusted for the newly compressed data so that the packet appears normal to other layers of the LAN protocol. A status byte may be added to the compressed data to disable compression on a remote LAN station. The compressed data packet is compatible with hubs to other LANs and bridges to WANs. The low-level compression is compatible with LANs that have older LAN stations that do not have compression capabilities, since the only packets compressed are those sent to LAN stations that support low-level compression. A destination address table is consulted which includes the compression capabilities of other LAN stations. Thus multi-point LANs can support data compression.

摘要翻译： 数据在诸如IEEE 802.2或802.3的工业标准局域网（LAN）中被压缩。 压缩发生在物理层上方的数据链路层中的较低级别。 数据包中的数据被压缩，但是源和目的地址不被压缩。 针对新的压缩长度调整指示数据字段的长度的类型/长度字段，同时为压缩数据重新生成针对未压缩数据计算的帧校验和。 因此，具有压缩数据的分组具有针对新压缩数据的长度和校验和，以使分组看起来与LAN协议的其他层正常。 状态字节可以被添加到压缩数据以禁用远程LAN站上的压缩。 压缩数据包与其他LAN的集线器和WAN的桥接兼容。 低级压缩与具有不具有压缩功能的较旧LAN站的LAN兼容，因为仅压缩的数据包是发送到支持低级压缩的LAN站的数据包。 查询目的地地址表，其中包括其他LAN站的压缩功能。 因此，多点LAN可以支持数据压缩。