公开(公告)号：US20230247853A1

公开(公告)日：2023-08-03

申请号：US18160508

申请日：2023-01-27

Applicant: The Florida State University Research Foundation, Inc.

Inventor： Hanwei Gao ,  Jue Gong ,  Brendon Tyler Jones ,  Moein Adnani

IPC: H10K50/844 ,  H10K30/88

CPC classification number: H10K50/844 ,  H10K30/88 ,  H10K85/50

Abstract: Methods of encapsulating perovskites, such as metal halide perovskites, that may include depositing a nitride or an oxide on a film that includes a perovskite. Composite materials that include a perovskite layer and a layer of a nitride or an oxide. Devices, such as electronic devices, that include composite materials.