公开(公告)号：US20210131753A1

公开(公告)日：2021-05-06

申请号：US17251127

申请日：2019-06-11

申请人： The Regents of the University of Colorado, a body corporate

发明人： Ronggui Yang ,  Rongfu Wen ,  Shanshan Xu ,  Yung-Cheng Lee

IPC分类号： F28F13/18 ,  F25B39/04

摘要： This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.

公开(公告)号：US11306983B2

公开(公告)日：2022-04-19

申请号：US17251127

申请日：2019-06-11

申请人： The Regents of the University of Colorado, a body corporate

发明人： Ronggui Yang ,  Rongfu Wen ,  Shanshan Xu ,  Yung-Cheng Lee

IPC分类号： F28F13/18 ,  F25B39/04 ,  H01L23/427 ,  F28D15/04

摘要： This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.

公开(公告)号：US20160081227A1

公开(公告)日：2016-03-17

申请号：US14853833

申请日：2015-09-14

申请人： The Regents of the University of Colorado, a body corporate

发明人： Yung-Cheng Lee ,  Shanshan Xu ,  Ronggui Yang ,  Collin Jennings Coolidge ,  Ryan John Lewis ,  Li-Anne Liew ,  Ching-Yi Lin

IPC分类号： H05K7/20

CPC分类号： H05K7/20509 ,  G06F1/20 ,  G06F1/203 ,  H05K7/20481

摘要： Embodiments described in this disclosure include a heat spreader. The heat spreader may include a first layer having a thickness less than about 300 microns; a plurality of pillars disposed on the first layer and arrayed in a pattern, wherein each of the plurality of pillars have a height of less than 100 microns; a second layer having a thickness of less than 200 microns, wherein a portion of the first layer and a portion of the second layer are sealed together; and a vacuum chamber formed between the first layer and the second layer and within which the plurality of pillars are disposed.

摘要翻译： 本公开中描述的实施例包括散热器。 散热器可以包括厚度小于约300微米的第一层; 设置在第一层上并以图案排列的多个柱，其中多个柱中的每一个具有小于100微米的高度; 厚度小于200微米的第二层，其中所述第一层的一部分和所述第二层的一部分被密封在一起; 以及形成在所述第一层和所述第二层之间并且所述多个柱体设置在所述真空室内的真空室。

公开(公告)号：US20240133643A1

公开(公告)日：2024-04-25

申请号：US18402490

申请日：2024-01-02

申请人： The Regents of the University of Colorado, a body corporate

发明人： Ronggui Yang ,  Rongfu Wen ,  Shanshan Xu ,  Yung-Cheng Lee

IPC分类号： F28F13/18 ,  F25B39/04 ,  F28D15/04 ,  H01L23/427

CPC分类号： F28F13/182 ,  F25B39/04 ,  F28D15/046 ,  F28F13/185 ,  H01L23/427

摘要： This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. In some instances, the single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.

公开(公告)号：US11898807B2

公开(公告)日：2024-02-13

申请号：US17689081

申请日：2022-03-08

申请人： The Regents of the University of Colorado, a body corporate

发明人： Ronggui Yang ,  Rongfu Wen ,  Shanshan Xu ,  Yung-Cheng Lee

IPC分类号： F28F13/18 ,  F25B39/04 ,  H01L23/427 ,  F28D15/04

CPC分类号： F28F13/182 ,  F25B39/04 ,  F28D15/046 ,  F28F13/185 ,  H01L23/427

摘要： This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.

公开(公告)号：US20220221233A1

公开(公告)日：2022-07-14

申请号：US17689081

申请日：2022-03-08

申请人： The Regents of the University of Colorado, a body corporate

发明人： Ronggui Yang ,  Rongfu Wen ,  Shanshan Xu ,  Yung-Cheng Lee

IPC分类号： F28F13/18 ,  F25B39/04 ,  H01L23/427 ,  F28D15/04

摘要： This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.

公开(公告)号：US20160076820A1

公开(公告)日：2016-03-17

申请号：US14857567

申请日：2015-09-17

申请人： THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE

发明人： Ryan John Lewis ,  Li-Anne Liew ,  Ching-Yi Lin ,  Collin Jennings Coolidge ,  Shanshan Xu ,  Ronggui Yang ,  Yung-Cheng Lee

IPC分类号： F28D15/04

摘要： A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.

摘要翻译： 公开了热接地平面（TGP）。 TGP可以包括构造成包围工作流体的第一平面衬底构件; 构造成包围工作流体的第二平面基板部件; 设置在所述第一平面基板上的多个芯吸结构; 以及设置在第二平面基板上的一个或多个平面间隔件。 第一平面基板和第二平面基板可以被气密密封。