公开(公告)号：US20200168658A1

公开(公告)日：2020-05-28

申请号：US16564254

申请日：2019-09-09

Applicant: The Regents of the University of Michigan

Inventor： Stephen Forrest ,  Xin Xu ,  Christopher Kyle Renshaw

IPC: H01L27/146 ,  H01L27/30 ,  H05K13/04 ,  H01L51/00 ,  H01L27/32

Abstract: Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems.

公开(公告)号：US10971542B2

公开(公告)日：2021-04-06

申请号：US16564254

申请日：2019-09-09

Applicant: The Regents of the University of Michigan

Inventor： Stephen Forrest ,  Xin Xu ,  Christopher Kyle Renshaw

IPC: H01L27/146 ,  H01L51/00 ,  H01L27/32 ,  H05K13/04 ,  H01L27/30

Abstract: Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems.

公开(公告)号：US10424612B2

公开(公告)日：2019-09-24

申请号：US15180537

申请日：2016-06-13

Applicant: The Regents of the University of Michigan

Inventor： Stephen R. Forrest ,  Xin Xu ,  Christopher Kyle Renshaw

IPC: H01L27/146 ,  H01L51/00 ,  H01L27/30 ,  H01L27/32 ,  H05K13/04

Abstract: A method of forming a semiconductor device includes the steps of providing a first circuit layer including a plurality of first contacts, providing one or more semiconductor devices disposed on a stamp, the one or more semiconductor devices including a plurality of second contacts, bonding the plurality of second contacts to the plurality of first contacts via a pressure applied by the stamp.