专利检索 ap:("Thermwood Corporation") AND inv:"Joshua A. Lough" 第 1 页

1.

发明授权
Systems and methods for greater inter-layer bond integrity in additive manufacturing 有权

公开(公告)号：US11241841B1

公开(公告)日：2022-02-08

申请号：US17200120

申请日：2021-03-12

申请人： Thermwood Corporation

发明人： Kenneth J. Susnjara , Brian S. Smiddy , Jonathan I. Fuquay , Joshua A. Lough

IPC分类号： B29C64/393 , B29C64/118 , B33Y50/02 , B33Y30/00 , B33Y10/00 , B29C64/386

摘要： An additive manufacturing apparatus includes an extruder configured to receive a thermoplastic material and an applicator assembly downstream of the extruder, the applicator assembly including a nozzle for depositing the thermoplastic material as a plurality of layers. The additive manufacturing apparatus also includes a temperature sensor configured to detect a temperature of at least a portion of a deposited layer and a positioning assembly configured to change an angular position of the temperature sensor.