公开(公告)号：US20110317390A1

公开(公告)日：2011-12-29

申请号：US13164847

申请日：2011-06-21

申请人： Thierry Moser ,  Ole Koudal ,  Nikolai Fink ,  Roland Unterseh ,  Markus Beissert ,  Frank Bonschab ,  Gernot Engstler

发明人： Thierry Moser ,  Ole Koudal ,  Nikolai Fink ,  Roland Unterseh ,  Markus Beissert ,  Frank Bonschab ,  Gernot Engstler

IPC分类号： H05K7/02 ,  H05K7/00

CPC分类号： H05K7/1462 ,  G01D11/245 ,  G01F15/14

摘要： An electronics housing comprises a housing basic body having a cavity, especially a single cavity. The housing basic body includes a side wall laterally bordering the cavity, an open end and a rear wall bounding the cavity on an end lying opposite the open end and remote therefrom. Also included is a housing lid releasably connected to the housing basic body on the open end and sealing the housing basic body; and an intermediate floor. The intermediate floor, in the case of the electronics housing of the invention, forms: a gap extending between an inner surface of the side wall of the housing basic body and a lateral surface of the intermediate floor facing the inner surface; and two housing chambers in the cavity of the housing basic body separated from one another by the intermediate floor. A first housing chamber is arranged on a first side of the intermediate floor facing the housing lid and a second housing chamber is arranged on a second side of the intermediate floor facing away from the housing lid. The intermediate floor is inserted into, and releasably affixed to, the housing basic body.

摘要翻译： 电子设备壳体包括具有空腔的壳体基体，特别是单个空腔。 壳体基体包括横向与空腔接合的侧壁，开口端和后壁，其在与开口端相对并远离的端部上限定空腔。 还包括壳体盖，其可拆卸地连接到开口端上的壳体基体并密封壳体基体; 和一个中间楼层。 在本发明的电子设备外壳的情况下，中间层形成：在壳体基体的侧壁的内表面和面向内表面的中间层的侧表面之间延伸的间隙; 并且壳体基本体的空腔中的两个容纳腔室通过中间地板彼此分开。 第一容纳室布置在面向壳体盖的中间地板的第一侧上，并且第二容纳室布置在中间地板的远离壳体盖的第二侧上。 中间地板被插入并可释放地固定在壳体基体上。