公开(公告)号：US09189037B2

公开(公告)日：2015-11-17

申请号：US13494047

申请日：2012-06-12

申请人： Thomas Brunschwiler ,  Eren Kursun ,  Gary W Maier

发明人： Thomas Brunschwiler ,  Eren Kursun ,  Gary W Maier

IPC分类号： G06F1/20 ,  H01L25/065

CPC分类号： G06F1/20 ,  H01L25/0657 ,  H01L2924/0002 ,  H01L2924/00

摘要： A computer-implemented method, system, and article of manufacture for optimizing heat transfer in a 3-D chip-stack. The method includes the steps of: receiving a heat-removal effectiveness parameter for a plurality of channel-region areas in the chip-stack, receiving at least one of a flow value and temperature value for at least two of the channel-region areas, comparing the received values for different channel-region areas, and adjusting a flow rate of a liquid flowing to at least one of the two channel-region areas based on the heat-removal effectiveness parameter of the channel-region area receiving the adjustment and the results of the comparison step, where at least one step is carried out using a computer device.

摘要翻译： 用于优化3-D芯片堆叠中的热传递的计算机实现的方法，系统和制品。 该方法包括以下步骤：接收码片堆叠中的多个信道区域区域的散热有效性参数，接收至少两个信道区域区域的流量值和温度值中的至少一个， 比较不同通道区域的接收值，并且基于接收调整的通道区域区域的散热效率参数来调节流入两个通道区域区域中的至少一个的液体的流量， 比较步骤的结果，其中使用计算机设备执行至少一个步骤。