Optical assembly and method of making same
    5.
    发明授权
    Optical assembly and method of making same 有权
    光学组件及其制作方法

    公开(公告)号:US07817883B2

    公开(公告)日:2010-10-19

    申请号:US12292313

    申请日:2008-11-17

    IPC分类号: G02B6/28

    摘要: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.

    摘要翻译: 光学组件包括具有第一表面和第二表面的第一透明衬底,具有基本上平行的第三和第四表面的第二透明衬底,第二透明衬底上的反射部分,第一衬底和反射部分之间的多个滤光器, 过滤器入射到其上的光束,所述多个滤光器和所述反射部分在所述第二透明基板内形成反射腔;准直透镜,用于准直入射到所述反射腔的光束;倾斜机构,用于将倾斜引导到光束 输入到反弹腔; 接收光束的输入端口和发射光束的输出端口。 倾斜机构可以在第一和第二基板之间。

    Optical assembly and method of making same
    6.
    发明申请
    Optical assembly and method of making same 有权
    光学组件及其制作方法

    公开(公告)号:US20090103866A1

    公开(公告)日:2009-04-23

    申请号:US12292313

    申请日:2008-11-17

    IPC分类号: G02B6/26

    摘要: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.

    摘要翻译: 光学组件包括具有第一表面和第二表面的第一透明衬底,具有基本上平行的第三和第四表面的第二透明衬底,第二透明衬底上的反射部分,第一衬底和反射部分之间的多个滤光器, 过滤器入射到其上的光束,所述多个滤光器和所述反射部分在所述第二透明基板内形成反射腔;准直透镜,用于准直入射到所述反射腔的光束;倾斜机构,用于将倾斜引导到光束 输入到反弹腔; 接收光束的输入端口和发射光束的输出端口。 倾斜机构可以在第一和第二基板之间。

    Optical wavelength division coupler and associated methods
    7.
    发明授权
    Optical wavelength division coupler and associated methods 有权
    光波分复用器及相关方法

    公开(公告)号:US07466502B2

    公开(公告)日:2008-12-16

    申请号:US11295720

    申请日:2005-12-07

    IPC分类号: G02B7/02

    摘要: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.

    摘要翻译: 光学组件包括具有第一表面和第二表面的第一透明衬底,具有基本上平行的第三和第四表面的第二透明衬底,第二透明衬底上的反射部分,第一衬底和反射部分之间的多个滤光器, 过滤器入射到其上的光束,所述多个滤光器和所述反射部分在所述第二透明基板内形成反射腔;准直透镜,用于准直入射到所述反射腔的光束;倾斜机构,用于将倾斜引导到光束 输入到反弹腔; 接收光束的输入端口和发射光束的输出端口。 倾斜机构可以在第一和第二基板之间。

    Thick wafer processing and resultant products
    8.
    发明授权
    Thick wafer processing and resultant products 有权
    厚晶圆加工及产品

    公开(公告)号:US06777311B2

    公开(公告)日:2004-08-17

    申请号:US10087989

    申请日:2002-03-05

    IPC分类号: H01L21301

    摘要: A thick wafer is diced by partially dicing a first side to form a first dice, flipping the wafer so that the first side is now in contact with a dicing tape, and dicing a second side. The dicing of the second side may be achieved by aligning a dicing tool to the first dice and/or alignment marks on the wafer. The thick wafer may be a composite wafer including two or more wafers bonded together. These two wafers may be different thicknesses and/or different materials.

    摘要翻译: 通过部分切割第一面以形成第一骰子来切割厚晶片,翻转晶片,使得第一面现在与切割胶带接触,并切割第二面。 可以通过将切割工具对准晶片上的第一骰子和/或对准标记来实现第二面的切割。 厚晶片可以是包括两个或更多个晶片结合在一起的复合晶片。 这两个晶片可以是不同的厚度和/或不同的材料。