公开(公告)号：US5852375A

公开(公告)日：1998-12-22

申请号：US797565

申请日：1997-02-07

申请人： Timothy Gerard Byrne ,  Brian T. Morley

发明人： Timothy Gerard Byrne ,  Brian T. Morley

IPC分类号： H03K19/003 ,  H03K3/00 ,  H02H3/20

CPC分类号： H03K19/00315

摘要： An integrated circuit has an I/O circuit that is connected to an I/O PAD. The I/O PAD may have greater voltage than the VDD associated with the integrated circuit so there is provided a switching circuit that is connected between the VDD and the I/O PAD. An output circuit is also provided that comprises n-channel transistors connected between the PAD and the ground. There is a cascode arrangement of p-channel transistors connected between the I/O PAD and VDD.

摘要翻译： 集成电路具有连接到I / O PAD的I / O电路。 I / O PAD可能具有比与集成电路相关的VDD更大的电压，因此提供了连接在VDD和I / O PAD之间的开关电路。 还提供了包括连接在PAD和地之间的n沟道晶体管的输出电路。 在I / O PAD和VDD之间连接有p沟道晶体管的共源共栅布置。