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公开(公告)号：US20230194200A1
公开(公告)日：2023-06-22
申请号：US17577927
申请日：2022-01-18
申请人： Ting-Hua Wu
发明人： Ting-Hua Wu
摘要： A gun-type firing device using a caseless projectile is disclosed. The caseless projectile has a bullet head and an impact seat at two ends thereof and a groove adjacent to the impact seat. The gun-type firing device includes a gunstock, a gun bolt and a gun barrel. The gun bolt is located on one side of the gunstock. The gun bolt includes a cocking handle and an extractor. The cocking handle can perform a linear displacement movement along the extension direction of the gunstock. The extractor is located at one end of the cocking handle. The gun barrel is located on the gunstock and is adjacent to one end of the gun bolt. The gun barrel does not have rifling.
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公开(公告)号：US10852107B1
公开(公告)日：2020-12-01
申请号：US16884368
申请日：2020-05-27
申请人： Ting-Hua Wu
发明人： Ting-Hua Wu
IPC分类号： F42B5/18
摘要： Disclosed herein is a caseless projectile, in which a bullet head and a projectile body structure are fixedly arranged with each other. The caseless projectile can be fired in a barrel without a step of discharging the case; further, the caseless projectile's projectile bottom has a plurality of blade-shaped score lines. When fired, the score line are transformed into a plurality of nozzle structures by the impact force, so that the high-pressure gas generated by the burning of powder is ejected through the nozzle structures, further offering the caseless projectile a rotational torque and achieving the effect of accurate firing without rifling.
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公开(公告)号：US08710638B2
公开(公告)日：2014-04-29
申请号：US12537047
申请日：2009-08-06
申请人： Ting-Hua Wu
发明人： Ting-Hua Wu
CPC分类号： B81C1/00269 , B81C2201/019 , B81C2203/0109 , H01L2924/0002 , H01L2924/00
摘要： A method for fabricating an integrated circuit device is disclosed. The method includes providing a first substrate; bonding a second substrate to the first substrate, the second substrate including a microelectromechanical system (MEMS) device; and bonding a third substrate to the first substrate.
摘要翻译： 公开了一种用于制造集成电路器件的方法。 该方法包括提供第一基板; 将第二衬底接合到第一衬底，第二衬底包括微机电系统（MEMS）器件; 以及将第三衬底接合到所述第一衬底。
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