摘要:
A nickel-titanium-rare earth (Ni—Ti-RE) alloy comprises nickel at a concentration of from about 35 at. % to about 65 at. %, a rare earth element at a concentration of from about 1.5 at. % to about 15 at. %, boron at a concentration of up to about 0.1 at. %, with the balance of the alloy being titanium. In addition to enhanced radiopacity compared to binary Ni—Ti alloys and improved workability, the Ni—Ti-RE alloy preferably exhibits superelastic behavior. A method of processing a Ni—Ti-RE alloy includes providing a nickel-titanium-rare earth alloy comprising nickel at a concentration of from about 35 at. % to about 65 at. %, a rare earth element at a concentration of from about 1.5 at. % to about 15 at. %, the balance being titanium; heating the alloy in a homogenization temperature range below a critical temperature; and forming spheroids of a rare earth-rich second phase in the alloy while in the homogenization temperature range.
摘要:
A nickel-titanium-rare earth (Ni—Ti-RE) alloy comprises nickel at a concentration of from about 35 at. % to about 65 at. %, a rare earth element at a concentration of from about 1.5 at. % to about 15 at. %, boron at a concentration of up to about 0.1 at. %, with the balance of the alloy being titanium. In addition to enhanced radiopacity compared to binary Ni—Ti alloys and improved workability, the Ni—Ti-RE alloy preferably exhibits superelastic behavior. A method of processing a Ni—Ti-RE alloy includes providing a nickel-titanium-rare earth alloy comprising nickel at a concentration of from about 35 at. % to about 65 at. %, a rare earth element at a concentration of from about 1.5 at. % to about 15 at. %, the balance being titanium; heating the alloy in a homogenization temperature range below a critical temperature; and forming spheroids of a rare earth-rich second phase in the alloy while in the homogenization temperature range.
摘要:
A process for removing hazardous substances from a LCD display (1) includes incision through off set lines (10) around the front of the panel (3). Top components are then removed to expose the fluorescent tubes (5) which contain hazardous substances. The incisions are parallel to the recessed lips, at a distance in the range of 0 to 20 mm from the recessed lips. The cuts are to a depth of 20 mm to 50 mm. Preferably, at least two incisions are made simultaneously. The fluorescent tubes (5) are crushed after the access operation, by rollers, chains or by plates. During crushing there is suction of the particles and gases which are released, thereby removing the hazardous substances by filtration.
摘要:
A process for removing hazardous substances from a LCD display (1) includes incision through off set lines (10) around the front of the panel (3). Top components are then removed to expose the fluorescent tubes (5) which contain hazardous substances. The incisions are parallel to the recessed lips, at a distance in the range of 0 to 20 mm from the recessed lips. The cuts are to a depth of 20 mm to 50 mm. Preferably, at least two incisions are made simultaneously. The fluorescent tubes (5) are crushed after the access operation, by rollers, chains or by plates. During crushing there is suction of the particles and gases which are released, thereby removing the hazardous substances by filtration.