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公开(公告)号：US20200267826A1
公开(公告)日：2020-08-20
申请号：US16793080
申请日：2020-02-18
Applicant: Tokyo Electron Limited
Inventor： Daisuke KAWADA , Koichi KAZAMA , Dong suk KIM , Namho YUN , Jisoo SUH
Abstract: There is provision of a substrate processing apparatus including a processing vessel, a radio frequency power supply configured to supply radio frequency (RF) current, and a member connected to the processing vessel electrically. The member is configured such that a surface area per unit volume of a first region of the member corresponding to a particular structure of the processing vessel differs from a surface area per unit volume of a second region of the member other than the first region, in order to adjust impedance of the member.
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