公开(公告)号：US20210217649A1

公开(公告)日：2021-07-15

申请号：US17145171

申请日：2021-01-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kazuhiko AKAHANE ,  Toshiya TSUKAHARA ,  Sungjae LEE ,  Namho YUN ,  Jisoo SUH

IPC: H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: An edge ring is disposed to surround a target substrate. The edge ring includes a first upper surface made of silicon carbide, tungsten carbide, magnesium oxide, or yttria, and a second upper surface made of silicon. The second upper surface is formed at a position lower than the first upper surface to face a bottom surface of a peripheral portion of the target substrate.

公开(公告)号：US20200267826A1

公开(公告)日：2020-08-20

申请号：US16793080

申请日：2020-02-18

Applicant: Tokyo Electron Limited

Inventor： Daisuke KAWADA ,  Koichi KAZAMA ,  Dong suk KIM ,  Namho YUN ,  Jisoo SUH

IPC: H05H1/46 ,  H01J37/32

Abstract: There is provision of a substrate processing apparatus including a processing vessel, a radio frequency power supply configured to supply radio frequency (RF) current, and a member connected to the processing vessel electrically. The member is configured such that a surface area per unit volume of a first region of the member corresponding to a particular structure of the processing vessel differs from a surface area per unit volume of a second region of the member other than the first region, in order to adjust impedance of the member.