公开(公告)号：US20230220550A1

公开(公告)日：2023-07-13

申请号：US18147157

申请日：2022-12-28

Applicant: Tokyo Electron Limited

Inventor： Morihito INAGAKI ,  Jin KUMAGAI

IPC: C23C16/46 ,  C23C16/52

CPC classification number: C23C16/46 ,  C23C16/52

Abstract: A heat treatment apparatus includes a processing container that accommodates a processing target; a heater that heats the processing target accommodated in the processing container; and a controller that controls an overall operation of the heat treatment apparatus. The controller controls heating by the heater according to a set temperature of the heater; monitors the processing container in which the processing target is accommodated based on a monitoring condition of a protection function for the processing target; and when an upper limit time of monitoring elapses while the monitoring condition is being satisfied, changes the set temperature of the heater to a set temperature of the protection function.