公开(公告)号：US20230220550A1

公开(公告)日：2023-07-13

申请号：US18147157

申请日：2022-12-28

Applicant: Tokyo Electron Limited

Inventor： Morihito INAGAKI ,  Jin KUMAGAI

IPC: C23C16/46 ,  C23C16/52

CPC classification number: C23C16/46 ,  C23C16/52

Abstract: A heat treatment apparatus includes a processing container that accommodates a processing target; a heater that heats the processing target accommodated in the processing container; and a controller that controls an overall operation of the heat treatment apparatus. The controller controls heating by the heater according to a set temperature of the heater; monitors the processing container in which the processing target is accommodated based on a monitoring condition of a protection function for the processing target; and when an upper limit time of monitoring elapses while the monitoring condition is being satisfied, changes the set temperature of the heater to a set temperature of the protection function.

公开(公告)号：US20240153748A1

公开(公告)日：2024-05-09

申请号：US18383673

申请日：2023-10-25

Applicant: Tokyo Electron Limited

Inventor： Morihito INAGAKI

IPC: H01J37/32

CPC classification number: H01J37/32715 ,  H01J37/32761 ,  H01J2237/332

Abstract: A method of controlling a substrate processing apparatus includes providing a substrate processing apparatus that includes a processing container, and a rotary table provided in the processing container and having a plurality of substrate placing portions in a circumferential direction on a top surface thereof; forming films on substrates on the substrate placing portions according to a process recipe by rotating the rotary table; unloading the substrates on the substrate placing portions from the processing container after the forming; and rotating the rotary table until before the unloading after the forming.

公开(公告)号：US20230175137A1

公开(公告)日：2023-06-08

申请号：US18073798

申请日：2022-12-02

Applicant: Tokyo Electron Limited

Inventor： Morihito INAGAKI ,  Takuya HIGUCHI ,  Hideomi HANE

IPC: C23C16/52 ,  C23C16/46 ,  C23C16/44 ,  C23C16/458 ,  C23C16/50

CPC classification number: C23C16/52 ,  C23C16/46 ,  C23C16/4405 ,  C23C16/4586 ,  C23C16/4584 ,  C23C16/50

Abstract: A heat treatment apparatus includes a control device. The control device includes a heat treatment control unit that controls a heat treatment performed on a processing target accommodated in a processing container, according to a process condition, a cleaning control unit that controls a cleaning process on deposits adhering to the processing container due to the heat treatment, a cumulative film thickness specification unit that specifies a value of a cumulative film thickness of the deposits adhering to the processing container, based on the process condition for the heat treatment, and a temperature correction unit that corrects a temperature of the heat treatment based on a temperature correction amount corresponding to the value of the cumulative film thickness and a frequency of the cleaning process.

公开(公告)号：US20250140539A1

公开(公告)日：2025-05-01

申请号：US18924053

申请日：2024-10-23

Applicant: Tokyo Electron Limited

Inventor： Morihito INAGAKI

IPC: H01J37/32 ,  G08B21/18

Abstract: An ignition condition calculation method includes (A) searching for ignition condition information including first plasma state information when a plasma is ignited under a preset ignition condition, and storing the ignition condition information in a storage; (B) searching for misfire condition information including second plasma state information when the plasma misfires after the plasma has been ignited, and storing the misfire condition information in the storage; and (C) displaying the ignition condition information and the misfire condition information on a display.

公开(公告)号：US20250034711A1

公开(公告)日：2025-01-30

申请号：US18778472

申请日：2024-07-19

Applicant: Tokyo Electron Limited

Inventor： Gaku WATANABE ,  Morihito INAGAKI

IPC: C23C16/458 ,  C23C16/455 ,  C23C16/52

Abstract: A substrate processing apparatus includes a processing container, a rotary table, a stage, an imaging device, and a controller. The rotary table includes a rotary table side marker capable of being positioned within an imaging range of the imaging device. The stage includes a stage side marker capable of being positioned within the imaging range of the imaging device. The controller recognizes a circumferential position of the rotary table based on the rotary table side marker included in the imaging information, and corrects a position of the rotary table when the rotary table side marker is misaligned. Further, the controller recognizes a circumferential position of the stage based on the stage side marker included in the imaging information, and corrects a position of the stage when the stage side marker is misaligned.

公开(公告)号：US20250006462A1

公开(公告)日：2025-01-02

申请号：US18747511

申请日：2024-06-19

Applicant: Tokyo Electron Limited

Inventor： Morihito INAGAKI

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/458

Abstract: A substrate processing method includes providing a substrate processing apparatus including a vacuum container, a rotary table that includes a placement surface on which a plurality of substrates is disposed, and rotates the plurality of substrates, a plasma generator that includes an antenna and generates a plasma in the vacuum container, and a first driving unit that moves the antenna; storing ignition condition information that associate a process condition and a position of the antenna with each other, in a storage; determining the position of the antenna corresponding to the process condition of the ignition condition information that matches a process condition set in a recipe by referring to the storage; and moving the antenna to the determined position of the antenna using the first driving unit, thereby processing the plurality of the substrates.