PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

    公开(公告)号:US20220076930A1

    公开(公告)日:2022-03-10

    申请号:US17468935

    申请日:2021-09-08

    Abstract: In a plasma processing apparatus, a controller specifies a time point when a current starts to flow between an edge ring and a DC power supply after beginning an application of a negative DC voltage to the edge ring from the DC power supply. The controller specifies, from a voltage measurement value indicating a voltage of the edge ring at the time point, an estimate of a self-bias voltage of the edge ring generated by a supply of a radio frequency power. The controller sets a sum of an absolute value of the estimate of the self-bias voltage and a set value as an absolute value of the negative DC voltage to be applied to the edge ring by the DC power supply.

    Plasma processing apparatus and plasma processing method

    公开(公告)号:US12205801B2

    公开(公告)日:2025-01-21

    申请号:US17468935

    申请日:2021-09-08

    Abstract: In a plasma processing apparatus, a controller specifies a time point when a current starts to flow between an edge ring and a DC power supply after beginning an application of a negative DC voltage to the edge ring from the DC power supply. The controller specifies, from a voltage measurement value indicating a voltage of the edge ring at the time point, an estimate of a self-bias voltage of the edge ring generated by a supply of a radio frequency power. The controller sets a sum of an absolute value of the estimate of the self-bias voltage and a set value as an absolute value of the negative DC voltage to be applied to the edge ring by the DC power supply.

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