公开(公告)号：US20210043471A1

公开(公告)日：2021-02-11

申请号：US16936977

申请日：2020-07-23

Applicant: Tokyo Electron Limited

Inventor： Katsuya NAKATA ,  Shogo FUKUI

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02

Abstract: A substrate processing apparatus performs a drying process for drying a substrate with a liquid film formed on a pattern formation surface thereof, using a processing fluid in a supercritical state. The substrate processing apparatus includes a processing container, a holder, and a processing liquid supply. The processing container accommodates the substrate. The holder holds the substrate inside the processing container. The processing liquid supply supplies a processing fluid into the processing container. Further, the holder includes a base, a plurality of support members, and a lifting mechanism. The base is disposed below the substrate. The plurality of support members are provided on the base, and support the substrate from below. The lifting mechanism moves the plurality of support members up and down.