公开(公告)号：US20240209509A1

公开(公告)日：2024-06-27

申请号：US18541164

申请日：2023-12-15

Applicant: Tokyo Electron Limited

Inventor： Naoya FUKUDA ,  Motoi YAMAGATA ,  Hiroshi SONE

IPC: C23C16/46 ,  C23C14/50 ,  C23C14/54 ,  C23C16/458

CPC classification number: C23C16/463 ,  C23C14/505 ,  C23C14/541 ,  C23C16/4584

Abstract: A substrate processing apparatus includes: a stage having a first contact surface; a freezing device having a second contact surface; an elevating device to be capable of thermally connecting or separating the second contact surface and the first contact surface; and a heat conductive member interposed between the first contact surface and the second contact surface, wherein the heat conductive member is made of a soft metal that is softer than at least one of a material of the first contact surface or a material of the second contact surface.