公开(公告)号：US20220220606A1

公开(公告)日：2022-07-14

申请号：US17638736

申请日：2020-07-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tamaki TAKEYAMA ,  Hiroaki CHIHAYA ,  Motoi YAMAGATA ,  Manabu NAKAGAWASAI ,  Shinji ORIMOTO

IPC: C23C14/54 ,  C23C14/50 ,  C23C14/34 ,  H01L21/687

Abstract: There is provided a method for processing a substrate, comprising: preparing a substrate processing device including a rotatable stage on which a substrate is placed, a frozen heat transfer body fixed on a backside of the stage with a gap interposed therebetween and cooled to an extremely low temperature, a gas supply mechanism configured to supply to the gap a cooling gas for transferring a cold heat of the frozen heat transfer body to the stage, a rotation mechanism configured to rotate the stage, and a processing mechanism configured to process the substrate; preheating the stage such that a temperature of the stage reaches a steady cooling temperature within a fixed range; and after preheating, continuously processing a plurality of substrates by the processing mechanism while rotating the stage that has reached the steady cooling temperature in a state where a substrate having a specific temperature higher than or equal to room temperature is placed on the stage.

公开(公告)号：US20240209509A1

公开(公告)日：2024-06-27

申请号：US18541164

申请日：2023-12-15

Applicant: Tokyo Electron Limited

Inventor： Naoya FUKUDA ,  Motoi YAMAGATA ,  Hiroshi SONE

IPC: C23C16/46 ,  C23C14/50 ,  C23C14/54 ,  C23C16/458

CPC classification number: C23C16/463 ,  C23C14/505 ,  C23C14/541 ,  C23C16/4584

Abstract: A substrate processing apparatus includes: a stage having a first contact surface; a freezing device having a second contact surface; an elevating device to be capable of thermally connecting or separating the second contact surface and the first contact surface; and a heat conductive member interposed between the first contact surface and the second contact surface, wherein the heat conductive member is made of a soft metal that is softer than at least one of a material of the first contact surface or a material of the second contact surface.

公开(公告)号：US20220238314A1

公开(公告)日：2022-07-28

申请号：US17574997

申请日：2022-01-13

Applicant: TOKYO ELECTRON LIMITED

Inventor： Motoi YAMAGATA ,  Hiroshi SONE ,  Masato SHINADA

IPC: H01J37/32 ,  C23C14/34 ,  C23C14/50 ,  C23C14/54

Abstract: A mounting table structure includes a mounting table on which a substrate is mounted, a refrigerating mechanism configured to cool the substrate, an elevating drive part configured to move the mounting table or the refrigerating mechanism up and down, and at least one contact provided at a position between the refrigerating mechanism and the mounting table which face each other. The refrigerating mechanism and the mounting table are allowed to be brought into contact with each other via the contact by moving the mounting table or the refrigerating mechanism up and down by the elevating drive part.

公开(公告)号：US20230249306A1

公开(公告)日：2023-08-10

申请号：US18164003

申请日：2023-02-03

Applicant: Tokyo Electron Limited

Inventor： Yusuke KIKUCHI ,  Masato SHINADA ,  Motoi YAMAGATA ,  Hiroshi SONE

IPC: B23Q11/10 ,  B23Q5/34

CPC classification number: B23Q11/10 ,  B23Q5/34 ,  B23Q2716/00 ,  B23Q2717/00

Abstract: A method of cooling a substrate by bringing a cooler into direct contact with a stage on which the substrate is placed, and processing the substrate while rotating the stage in a state in which the cooler is moved away from the stage, includes: cooling the cooler to a target temperature in a state in which the stage is brought into direct contact with the cooler, and cooling the stage to an initial cooling temperature; raising a temperature of the stage; controlling the temperature of the stage to a steady cooling temperature when the temperature of the stage reaches the steady cooling temperature; and placing the substrate on the stage kept at the steady cooling temperature, and continuously performing a substrate processing on a plurality of substrates while rotating the stage in a state in which the stage is moved away from the cooler.

公开(公告)号：US20210280777A1

公开(公告)日：2021-09-09

申请号：US17193545

申请日：2021-03-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Manabu NAKAGAWASAI ,  Koji MAEDA ,  Shinji ORIMOTO ,  Motoi YAMAGATA

IPC: H01L43/12 ,  C23C14/54 ,  C23C14/50

Abstract: A substrate processing apparatus includes a processing chamber where a substrate support on which a substrate is placed and a target holder configured to hold a target are disposed, a freezing device disposed with a gap with respect to a bottom surface of the substrate support and having a chiller and a cold heat medium laminated on the chiller, and a rotating device configured to rotate the substrate support. The substrate processing apparatus further includes a first elevating device configured to raise and lower the substrate support, a coolant channel formed in the chiller to supply a coolant to the gap, and a cold heat transfer material disposed in the gap and being in contact with the substrate support and the cold heat medium so as to transfer heat therebetween.

公开(公告)号：US20250122625A1

公开(公告)日：2025-04-17

申请号：US18834129

申请日：2023-01-25

Applicant: TOKYO ELECTRON LIMITED

Inventor： Motoi YAMAGATA ,  Hiroshi SONE ,  Masato SHINADA ,  Yusuke KIKUCHI

IPC: C23C16/46

Abstract: Provided is a substrate processing apparatus that has an improved cooling performance. This substrate processing apparatus comprises: a placing table which is provided in a processing container and on which a substrate is to be placed; a refrigerator that has a contacting surface that makes contact with or is separated from a contact target surface of the placing table, and cools the placing table; and a lifting/lowering device that lifts or lowers the refrigerator and generates a pressing force for pressing the refrigerator against the placing table.

公开(公告)号：US20220151078A1

公开(公告)日：2022-05-12

申请号：US17521563

申请日：2021-11-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Manabu NAKAGAWASAI ,  Motoi YAMAGATA

IPC: H05K3/30 ,  H01L21/67

Abstract: There is provided a method for manufacturing a substrate with a sensor in which a sensor is disposed on a plate-shaped substrate. The method comprises: holding the sensor by a magnetic force from a position on an opposite surface of a surface of the plate-shaped substrate on which the sensor is disposed that corresponds to a position where the sensor is fixed; and fixing the sensor to the plate-shaped substrate by curing an adhesive attached to the sensor in a state where the sensor is held by the magnetic force.