公开(公告)号：US20230234188A1

公开(公告)日：2023-07-27

申请号：US17727279

申请日：2022-04-22

Applicant: Tokyo Electron Limited

Inventor： Nathan Ip ,  Nima Nejadsadeghi

IPC: B25B11/00 ,  H01L21/683 ,  H01L21/66

CPC classification number: B25B11/005 ,  H01L21/6838 ,  H01L22/20

Abstract: A wafer bonding apparatus including: a first chuck in a processing chamber, the first chuck being configured to hold a first wafer, the first chuck including: a chuck body, and a tunable stiffness layer including a plurality of actuators, the plurality of actuators including a tunable stiffness material, the tunable stiffness layer being disposed below the chuck body; a controller configured to send control signals to one or more of the plurality of actuators; and a vacuum line on the chuck body configured to apply a vacuum pressure from a vacuum pump to the first wafer; and a second chuck in the processing chamber, the second chuck being configured to hold a second wafer to be bonded with the first wafer; and where a stiffness of the plurality of actuators is configured to change based on the control signals from the controller.