公开(公告)号：US20240387176A1

公开(公告)日：2024-11-21

申请号：US18688382

申请日：2022-08-19

Applicant: Tokyo Electron Limited

Inventor： Noboru OOIKE ,  Kiyotaka IMAI ,  Yoshihiro HIROTA ,  Motoyuki SATO

IPC: H01L21/18 ,  B23K26/53 ,  B23K101/40

Abstract: A stacked substrate for laser lift-off includes a first substrate that transmits a laser beam, a first insulating layer that absorbs the laser beam, a first polysilicon layer that transmits the laser beam, a second insulating layer that absorbs the laser beam, a second polysilicon layer that transmits the laser beam, and a first device layer in an order. The stacked substrate includes a first electrode penetrating the first insulating layer to electrically connect the first substrate and the first polysilicon layer, and a second electrode penetrating the second insulating layer to electrically connect the first polysilicon layer and the second polysilicon layer. The first electrode and the second electrode contain a material that transmits the laser beam, and are positioned apart from each other without being overlapped when viewed from a top.