公开(公告)号：US12244972B2

公开(公告)日：2025-03-04

申请号：US17776800

申请日：2020-11-04

Applicant: Tokyo Electron Limited

Inventor： Yuichiro Kunugimoto ,  Keishi Hamada ,  Takafumi Hayama ,  Motoi Okada ,  Shoki Hamaguchi

IPC: H04N7/18 ,  B05C11/00 ,  B05C11/10 ,  G03F7/16 ,  G06T7/00 ,  H04N5/91 ,  H04N23/69 ,  H04N23/80

Abstract: A monitoring apparatus for a substrate processing apparatus includes: an imaging unit that captures an image of a nozzle of the substrate processing apparatus and a surface of a substrate held by a substrate holder of the substrate processing apparatus; a monitoring data generation unit that generates monitoring video data based on imaging video data captured by the imaging unit during an execution of a substrate process performed by the substrate processing apparatus including a first process and a second process; and a monitoring condition changing unit that changes a generation condition of the monitoring video data during the execution of the substrate process so that at least a resolution or a number of frames of the monitoring video data during an execution of the second process is different from the monitoring video data during an execution of the first process.