公开(公告)号：US11914298B2

公开(公告)日：2024-02-27

申请号：US17016643

申请日：2020-09-10

Applicant: Tokyo Electron Limited

Inventor： Yuichiro Kunugimoto ,  Takafumi Hayama ,  Hidehiro Suzuki

IPC: G03F7/16 ,  H01L21/67 ,  B05B15/50

CPC classification number: G03F7/162 ,  B05B15/50 ,  H01L21/6715 ,  H01L21/67253

Abstract: There is provided a liquid processing apparatus comprising: a stage on which a substrate is placed; a nozzle configured to supply a processing liquid to the substrate placed on the stage and perform a processing on the substrate; a capturing part configured to capture an image of the nozzle so as to acquire image data; and a detector configured to detect a liquid level based on a plurality of the image data acquired by the capturing part at different timings within a period in which a supply of the processing liquid from the nozzle is not performed, wherein the liquid level is formed by the processing liquid or a liquid other than the processing liquid in a processing liquid flow path provided inside the nozzle.

公开(公告)号：US11637031B2

公开(公告)日：2023-04-25

申请号：US17037131

申请日：2020-09-29

Applicant: Tokyo Electron Limited

Inventor： Michael Carcasi ,  Joshua Hooge ,  Mark Somervell ,  Hiroyuki Iwaki ,  Masahide Tadokoro ,  Masashi Enomoto ,  Joel Estrella ,  Yuichiro Kunugimoto

IPC: H01L21/68 ,  B05D1/00 ,  G06T7/13 ,  G06T7/00 ,  G06T7/73 ,  B05B12/08 ,  G01N21/95 ,  H01L21/67 ,  H01L21/66 ,  G01N21/84

Abstract: Camera images may be utilized to detect substrate edges and provide information regarding the centering of the substrate within the fluid dispense system. Camera images may also be utilized to monitoring the location of a cup within the fluid dispense system. The signal processing techniques utilized may include data smoothing, analyzing only certain wavelengths of reflected energy, transforming the data (in one embodiment utilizing a Fourier transform), and/or analyzing a sub-set of the collected pixels of data. The camera image data collected herein may be combined with a wide variety of other data so as to better monitor, characterize and/or control a substrate processing process flow.

公开(公告)号：US20210134637A1

公开(公告)日：2021-05-06

申请号：US17037131

申请日：2020-09-29

Applicant: Tokyo Electron Limited

Inventor： Michael Carcasi ,  Joshua Hooge ,  Mark Somervell ,  Hiroyuki Iwaki ,  Masahide Tadokoro ,  Masashi Enomoto ,  Joel Estrella ,  Yuichiro Kunugimoto

IPC: H01L21/68 ,  B05D1/00 ,  G06T7/73 ,  G06T7/13 ,  G06T7/00

Abstract: Camera images may be utilized to detect substrate edges and provide information regarding the centering of the substrate within the fluid dispense system. Camera images may also be utilized to monitoring the location of a cup within the fluid dispense system. The signal processing techniques utilized may include data smoothing, analyzing only certain wavelengths of reflected energy, transforming the data (in one embodiment utilizing a Fourier transform), and/or analyzing a sub-set of the collected pixels of data. The camera image data collected herein may be combined with a wide variety of other data so as to better monitor, characterize and/or control a substrate processing process flow.

公开(公告)号：US20210129166A1

公开(公告)日：2021-05-06

申请号：US17037142

申请日：2020-09-29

Applicant: Tokyo Electron Limited

Inventor： Michael Carcasi ,  Joshua Hooge ,  Mark Somervell ,  Hiroyuki Iwaki ,  Masahide Tadokoro ,  Masashi Enomoto ,  Joel Estrella ,  Yuichiro Kunugimoto

IPC: B05B12/08 ,  G01N21/95 ,  H01L21/67 ,  H01L21/66

Abstract: In a liquid dispense system, camera images may be utilized to identify puddle edges of a liquid dispensed on a substrate. The camera image may be used to determine the percentage of puddle coverage and puddling non-idealities. The camera within a fluid dispense system may also be utilized to monitor the intensity of wavelengths reflected from a substrate during a spin coating step. The reflected intensity as a function of time as a substrate is spin coated may be used to monitor and characterize a spin coating process. The reflected intensity as a function of time may be compared to other substrates to identify substrate to substrate film thickness variations. The analysis may be based upon peaks and/or troughs of the reflected intensity as a function of time.

公开(公告)号：US12244972B2

公开(公告)日：2025-03-04

申请号：US17776800

申请日：2020-11-04

Applicant: Tokyo Electron Limited

Inventor： Yuichiro Kunugimoto ,  Keishi Hamada ,  Takafumi Hayama ,  Motoi Okada ,  Shoki Hamaguchi

IPC: H04N7/18 ,  B05C11/00 ,  B05C11/10 ,  G03F7/16 ,  G06T7/00 ,  H04N5/91 ,  H04N23/69 ,  H04N23/80

Abstract: A monitoring apparatus for a substrate processing apparatus includes: an imaging unit that captures an image of a nozzle of the substrate processing apparatus and a surface of a substrate held by a substrate holder of the substrate processing apparatus; a monitoring data generation unit that generates monitoring video data based on imaging video data captured by the imaging unit during an execution of a substrate process performed by the substrate processing apparatus including a first process and a second process; and a monitoring condition changing unit that changes a generation condition of the monitoring video data during the execution of the substrate process so that at least a resolution or a number of frames of the monitoring video data during an execution of the second process is different from the monitoring video data during an execution of the first process.

公开(公告)号：US12174549B2

公开(公告)日：2024-12-24

申请号：US18213785

申请日：2023-06-23

Applicant: Tokyo Electron Limited

Inventor： Yuichiro Kunugimoto ,  Shota Ueyama ,  Akihiro Teramoto ,  Yuta Nishiyama ,  Shinichi Hatakeyama

IPC: G01F9/00 ,  B08B3/02 ,  B08B13/00 ,  G01G21/22 ,  G03F7/00 ,  G03F7/16

Abstract: A substrate processing system includes: a measuring unit provided detachably with respect to a placement portion of a placement stage; a measuring jig for measuring a processing liquid; a liquid processing unit including a supplier which supplies the processing liquid to the measuring jig; a transfer mechanism for transferring the measuring jig between the measuring unit and the liquid processing unit; and a controller. The controller executes: a process of transferring the measuring jig in the measuring unit from the measuring unit to the liquid processing unit; a process of ejecting the processing liquid from the supplier to the measuring jig; a third process of transferring the measuring jig from the liquid processing unit to the measuring unit; and a fourth process of calculating an ejection amount of the processing liquid based on a measurement value in the measuring unit.

公开(公告)号：US09766543B2

公开(公告)日：2017-09-19

申请号：US14621522

申请日：2015-02-13

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yuichiro Kunugimoto ,  Izumi Hasegawa

IPC: B05C11/00 ,  B05C11/02 ,  G03B27/32 ,  G03B27/52 ,  G03F7/16 ,  H01L21/67 ,  G03F7/30 ,  H01L21/66

CPC classification number: G03F7/16 ,  G03F7/162 ,  G03F7/30 ,  G03F7/3021 ,  H01L21/67023 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/12 ,  H01L22/20

Abstract: In one embodiment, a liquid treatment method includes (A) imaging a discharging port part of the liquid nozzle each time the discharging process is performed to one substrate, and acquiring, from images thus obtained, size data on foreign matter possibly present at the discharging port part; and (B) based on a history of the size data arranged in chronological order, judging whether an abnormality in substrate-processing has occurred. In the item (B), if the number of continuous acquisition, indicating how many times the size data not smaller than a first threshold value has been acquired continuously, exceeds a predetermined value, then judging that an abnormality in substrate-processing has occurred.

公开(公告)号：US12057327B2

公开(公告)日：2024-08-06

申请号：US18107935

申请日：2023-02-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka Gosho ,  Yuichi Douki ,  Satoshi Biwa ,  Satoshi Okamura ,  Katsuhiro Ookawa ,  Yuichiro Kunugimoto

IPC: H01L21/67 ,  B08B3/08 ,  B08B7/04 ,  H01L21/02 ,  H01L21/66 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B7/04 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67028 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/68764 ,  H01L22/12 ,  H01L22/20 ,  H01L21/67248

Abstract: There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.

公开(公告)号：US11726409B2

公开(公告)日：2023-08-15

申请号：US17522050

申请日：2021-11-09

Applicant: Tokyo Electron Limited

Inventor： Yuichiro Kunugimoto ,  Shota Ueyama ,  Akihiro Teramoto ,  Yuta Nishiyama ,  Shinichi Hatakeyama

IPC: G01G21/22 ,  G03F7/00 ,  B08B13/00 ,  G01F9/00 ,  G03F7/16 ,  B08B3/02

CPC classification number: G03F7/70491 ,  B08B3/02 ,  B08B13/00 ,  G01F9/003 ,  G01G21/22 ,  G03F7/16

Abstract: A substrate processing system includes: a measuring unit provided detachably with respect to a placement portion of a placement stage; a measuring jig for measuring a processing liquid; a liquid processing unit including a supplier which supplies the processing liquid to the measuring jig; a transfer mechanism for transferring the measuring jig between the measuring unit and the liquid processing unit; and a controller. The controller executes: a process of transferring the measuring jig in the measuring unit from the measuring unit to the liquid processing unit; a process of ejecting the processing liquid from the supplier to the measuring jig; a third process of transferring the measuring jig from the liquid processing unit to the measuring unit; and a fourth process of calculating an ejection amount of the processing liquid based on a measurement value in the measuring unit.

公开(公告)号：US10248030B2

公开(公告)日：2019-04-02

申请号：US15897477

申请日：2018-02-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Toyohisa Tsuruda ,  Yuichiro Kunugimoto ,  Takafumi Hayama ,  Keishi Hamada

IPC: G03F7/20 ,  G03F7/30 ,  H01L21/67 ,  G06F17/30

Abstract: A method for evaluating a process recipe used in a liquid processing apparatus that performs a liquid processing by supplying a processing liquid from a nozzle to a substrate while rotating a holding part horizontally holding the substrate about a vertical axis, includes: storing the process recipe in a first storage part, which includes time-series data of a first combination of parameter values including a position of the nozzle and a rotation speed of the substrate; reading the process recipe from the first storage part; reading a pre-prepared risk data from a second storage part, which is determined by associating a second combination of parameter values with a risk information corresponding to a liquid splash risk; and displaying an assisting data for the first combination of parameter values in the process recipe, based on the process recipe and the pre-prepared risk data read from the first and second storage parts.