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1.
公开(公告)号:US20210191271A1
公开(公告)日:2021-06-24
申请号:US17130126
申请日:2020-12-22
Applicant: Tokyo Electron Limited
Inventor: Takuya Miura , Shougo Takahashi , Kouichirou Tanaka
Abstract: A liquid processing apparatus includes a substrate holder configured to hold a substrate; a processing liquid supply configured to supply a processing liquid onto a front surface of the substrate; a gas supply configured to supply a gas onto the front surface of the substrate; and a controller. The gas supply includes a diffusion nozzle which is provided with multiple discharge openings respectively elongated at different angles with respect to the front surface of the substrate. The controller performs controlling the gas supply to jet the gas from the diffusion nozzle onto a region of the front surface of the substrate including at least a central portion thereof in a state that the processing liquid is supplied on the front surface of the substrate.
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公开(公告)号:US12072625B2
公开(公告)日:2024-08-27
申请号:US17238541
申请日:2021-04-23
Applicant: Tokyo Electron Limited
Inventor: Takuya Miura , Kouichirou Tanaka , Shogo Takahashi , Yusuke Miyakubo , Kentaro Yoshihara
IPC: G03F7/00
CPC classification number: G03F7/0025
Abstract: A nozzle unit for a liquid treatment apparatus that performs a liquid treatment on a substrate using a liquid, includes a first gas nozzle having a discharge flow path for allowing a first gas to flow through the discharge flow path and a first discharge port for discharging the first gas flowing through the discharge flow path toward a surface of the substrate, wherein the first discharge port is formed so as to extend in a first direction along the surface, and wherein a width of the discharge flow path in the first direction increases as the discharge flow path approaches the first discharge port, so that the first gas is discharged radially from the first discharge port.
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3.
公开(公告)号:US11693322B2
公开(公告)日:2023-07-04
申请号:US17130126
申请日:2020-12-22
Applicant: Tokyo Electron Limited
Inventor: Takuya Miura , Shougo Takahashi , Kouichirou Tanaka
Abstract: A liquid processing apparatus includes a substrate holder configured to hold a substrate; a processing liquid supply configured to supply a processing liquid onto a front surface of the substrate; a gas supply configured to supply a gas onto the front surface of the substrate; and a controller. The gas supply includes a diffusion nozzle which is provided with multiple discharge openings respectively elongated at different angles with respect to the front surface of the substrate. The controller performs controlling the gas supply to jet the gas from the diffusion nozzle onto a region of the front surface of the substrate including at least a central portion thereof in a state that the processing liquid is supplied on the front surface of the substrate.
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