专利检索 ap:("Tokyo Electron Limited") AND inv:"Tomoya WATANABE" 第 1 页

1.

发明公开
ELECTROSTATIC CHUCK, SUBSTRATE PROCESSING APPARATUS, AND MANUFACTURING METHOD OF ELECTROSTATIC CHUCK 审中-公开

公开(公告)号：US20240234107A1

公开(公告)日：2024-07-11

申请号：US18399821

申请日：2023-12-29

申请人： Tokyo Electron Limited

发明人： Masato MINAMI , Tomoya WATANABE

IPC分类号： H01J37/32 , H02N13/00

CPC分类号： H01J37/32715 , H02N13/00 , H01J2237/2007

摘要： An electrostatic chuck having a support surface configured to support a substrate, wherein the support surface is configured by a plurality of protrusions that is formed at a same height and is arranged in a direction in which the support surface extends, wherein a distance between the plurality of protrusions adjacent to each other is in a range of 0.2 mm to 0.5 mm, and wherein, in a plan view of the support surface, an area occupancy rate of the plurality of protrusions in a 1 mm2 unit of the support surface is in a range of 3% to 40%.