公开(公告)号：US20230095452A1

公开(公告)日：2023-03-30

申请号：US17820039

申请日：2022-08-16

Applicant: Tokyo Electron Limited

Inventor： Tomoyuki OSHIMA ,  Takehiro SHINDO

IPC: H01L21/67 ,  H01L21/677 ,  C23C14/56

Abstract: A substrate processing system includes a load-lock module including load-lock module stages, a process module including process module stages, a vacuum transfer module that connects the load-lock module to the process module, a first transfer device that transfers substrates from the load-lock module stages to the process module stages, the first transfer device being provided in the vacuum transfer module, a second transfer device that transfers the substrates to the load-lock module stages, and a processor. The processor is configured to perform teaching a position at which the first transfer device receives the substrates from the load-lock module, teaching a position at which the first transfer device delivers the substrates to the process module, measuring shift amounts between the process module stages and the substrates mounted thereon, and correcting positions at which the second transfer device delivers the substrates to the load-lock module stages based on the measured shift amounts.