专利检索 ap:("Tokyo Electron Limited") AND inv:"Tsutomu FUKUNAGA" 第 1 页

1.

发明申请
SUBSTRATE PROCESSING APPARATUS, POLISHING PAD INSPECTING DEVICE, AND METHOD FOR INSPECTING POLISHING PAD 有权

公开(公告)号：US20220281051A1

公开(公告)日：2022-09-08

申请号：US17678400

申请日：2022-02-23

申请人： Tokyo Electron Limited

发明人： Tsutomu FUKUNAGA

IPC分类号： B24B37/005 , B24B53/017 , G06T7/00 , H04N5/225

摘要： A substrate processing apparatus includes: a polishing pad that polishes a substrate; a pod that accommodates a polishing surface of the polishing pad, which is brought into contact with the substrate; an imaging unit that images the polishing surface of the polishing pad through the pod; and an image processing unit that processes image data imaged by the imaging unit to detect deterioration of the polishing pad.