HEAT TREATMENT APPARATUS
    1.
    发明申请
    HEAT TREATMENT APPARATUS 有权
    热处理设备

    公开(公告)号:US20110248024A1

    公开(公告)日:2011-10-13

    申请号:US13092650

    申请日:2011-04-22

    IPC分类号: H05B6/10

    CPC分类号: H01L21/67109 H01L21/67303

    摘要: In-plane temperature of each substrate is uniformly controlled at the time of heating substrates placed on a plurality of susceptors, respectively. A heat treatment apparatus is provided with susceptors, i.e., conductive members for placing wafers thereon, having an induction heating body electrically divided into a center portion thereof and a peripheral portion thereof; a quartz boat supporting the susceptors arranged in a row; an induction coil, which is arranged inside a processing chamber to surround the circumference of each of the susceptors and configured such that the temperature of the induction coil can be freely adjusted; and a control unit which performs temperature control by changing the ratio between heat value at the center portion of the induction heating body and that at the peripheral portion, by controlling two high frequency currents of different frequencies to be applied to the induction coil from a high frequency current circuit.

    摘要翻译: 在分别加热放置在多个基座上的基板时,均匀地控制每个基板的面内温度。 一种热处理设备设置有基座,即用于在其上放置晶片的导电构件,具有电分割成其中心部分的感应加热体及其周边部分; 支撑排列成一排的基座的石英舟; 感应线圈,其布置在处理室内部以围绕每个基座的圆周并且被配置为使得感应线圈的温度可以自由地调节; 以及控制单元,其通过改变感应加热体的中心部分的热值与周边部分的热值之比,通过从高电平控制施加到感应线圈的不同频率的两个高频电流来进行温度控制 频率电流电路。