公开(公告)号：US20090277786A1

公开(公告)日：2009-11-12

申请号：US12437912

申请日：2009-05-08

申请人： Tomohiro ASOU ,  Seiya KUNIOKA ,  Hitoshi MURAMATSU ,  Nobuyuki SUZUKI ,  Akira ISHIBASHI ,  Minoru IMAI ,  Manabu SUZUKI ,  Masahiro OGAWA

发明人： Tomohiro ASOU ,  Seiya KUNIOKA ,  Hitoshi MURAMATSU ,  Nobuyuki SUZUKI ,  Akira ISHIBASHI ,  Minoru IMAI ,  Manabu SUZUKI ,  Masahiro OGAWA

IPC分类号： C25D17/00

CPC分类号： C25F7/00 ,  C25D11/005 ,  C25D11/02 ,  C25D17/00

摘要： A plating processing line or system includes a plurality of surface processing apparatus including a surface processing apparatus for processing a surface of an object to be treated by introducing a treatment liquid to the surface, and a conveyer unit for conveying the object to be treated, which is disposed between the respective surface processing apparatus linearly or in a curved manner. Each of the surface processing apparatus includes a positioning unit for positioning the object to be treated, which has been conveyed by the conveyer unit to a predetermined position, at which the object is subjected to a pre-plating process or a plating process as a surface processing.

摘要翻译： 电镀处理线或系统包括多个表面处理装置，其包括用于通过将处理液引入到表面来处理待处理物体的表面的表面处理装置和用于输送被处理物体的输送单元， 以各种表面处理装置线性或弯曲的方式设置。 每个表面处理设备包括一个定位单元，用于将被输送单元输送的被处理物体定位在预定位置，该预定位置处理该物体经过预镀处理或电镀处理作为表面 处理。