Coating and developing apparatus, operating method for same, and storage medium for the method
    1.
    发明授权
    Coating and developing apparatus, operating method for same, and storage medium for the method 有权
    涂料和显影装置,其操作方法和方法的存储介质

    公开(公告)号:US07844359B2

    公开(公告)日:2010-11-30

    申请号:US12128437

    申请日:2008-05-28

    IPC分类号: G06F19/00 H01L21/00

    CPC分类号: H01L21/67225 H01L21/67276

    摘要: In a coating and developing apparatus applied to liquid-immersion light exposure, substrates without an appropriately formed protective film can be recovered without adversely affecting normal-substrate processing efficiency, and in addition, removal of protective films can be simplified. In the coating and developing apparatus of the present invention, abnormal substrates not appropriately surface-coated with a protective film during liquid-immersion light exposure are queued in a queuing module, instead of being loaded into an exposure unit, and after the immediately preceding substrate has been unloaded from the exposure unit and loaded into a designated module, for example, a pre-developing second heating module, each abnormal substrate is loaded into the designated module in order to prevent so-called “scheduled transfer” from being affected, and a protective-film removing unit is also controlled to process the abnormal substrate.

    摘要翻译: 在适用于液浸式曝光的涂布显影装置中,可以回收没有适当形成的保护膜的基板,而不会不利地影响正常的基板处理效率,另外可以简化保护膜的去除。 在本发明的涂布和显影装置中,在液浸式曝光期间不被适当表面涂覆有保护膜的异常基板排队在排队模块中,而不是装载到曝光单元中,并且在紧接在前面的基板 已经从曝光单元卸载并加载到指定的模块中,例如预先显影的第二加热模块中,每个异常基板被装载到指定模块中,以防止所谓的“计划传送”受到影响,并且 还控制保护膜去除单元以处理异常衬底。

    Substrate processing method, substrate processing apparatus, and computer readable storage medium
    2.
    发明授权
    Substrate processing method, substrate processing apparatus, and computer readable storage medium 失效
    基板处理方法,基板处理装置和计算机可读存储介质

    公开(公告)号:US07618203B2

    公开(公告)日:2009-11-17

    申请号:US12051995

    申请日:2008-03-20

    IPC分类号: G03D5/00 G06F19/00 B05C11/00

    CPC分类号: H01L21/67276

    摘要: In the present invention, when trouble occurs and the operation of a substrate processing apparatus is stopped, substrate information containing positions and processing states of the substrates located in the apparatus at that time is stored, and the power supply of the apparatus is then turned off. When the apparatus is restarted, the substrates located in the apparatus are collected into a substrate housing unit, and each of the substrates in the substrate housing unit is then sequentially transferred to a plurality of processing units following the same transfer recipe as that before occurrence of trouble, and substrate processing is not performed in a processing unit in which processing has already been completed, whereas substrate processing is performed in a processing unit in which processing has not been performed yet, based on the substrate information.

    摘要翻译: 在本发明中,当故障发生并且基板处理装置的操作停止时,存储包含位于该装置中的基板的位置和处理状态的基板信息,然后关闭该装置的电源 。 当设备重新启动时,位于设备中的基板被收集到基板收纳单元中,然后将基板收纳单元中的每个基板顺序地转移到多个处理单元,遵循与发生之前相同的转移配方 在已经完成处理的处理单元中不执行故障和基板处理,而在尚未执行处理的处理单元中,基于基板信息执行基板处理。

    Substrate processing system and substrate processing method
    3.
    发明授权
    Substrate processing system and substrate processing method 失效
    基板加工系统和基板加工方法

    公开(公告)号:US06526329B2

    公开(公告)日:2003-02-25

    申请号:US09866717

    申请日:2001-05-30

    IPC分类号: G06F700

    摘要: The present invention is a substrate processing method comprising the steps of successively extracting unprocessed wafers from a cassette, successively conveying the extracted wafers to a plurality of processing units, causing the processing units to process the wafers in parallel, and returning the processed wafers to a cassette. A process completion prediction time at which processes for one lot are completed is calculated and displayed corresponding to a process recipe that has been set to a plurality of wafers for at least one lot. Corresponding to the process completion prediction time, a cassette that contains a plurality of unprocessed wafers for one lot is accepted. A cassette that contains a plurality of processed wafers for one lot is returned.

    摘要翻译: 本发明是一种基板处理方法,包括以下步骤:从盒中连续提取未处理的晶片,将提取的晶片连续地传送到多个处理单元,使处理单元平行地处理晶片,并将处理后的晶片返回到 盒式磁带 根据已经设定为至少一批的多个晶片的处理配方,计算并显示一批完成处理的处理完成预测时间。 对应于处理完成预测时间,接收一批包含多个未处理的晶片的盒。 返回包含一批批处理的多个晶片的盒。