公开(公告)号：US07998296B2

公开(公告)日：2011-08-16

申请号：US12230238

申请日：2008-08-26

申请人： Tony Ricci ,  Jim Tappan ,  Keith Comendant

发明人： Tony Ricci ,  Jim Tappan ,  Keith Comendant

IPC分类号： B32B37/00

CPC分类号： H01L21/76251 ,  H01L21/68757 ,  H01L21/68785

摘要： A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member, and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member. The protective ring is originally fabricated with dimensions the provide mechanical stability and workability. The protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application.

摘要翻译： 一种保护适于在等离子体处理系统中使用的衬底支撑体中的接合层的方法。 该方法包括以下步骤：用基板材料将基板支撑件的上部构件附接到基板支撑件的下部构件。 粘合剂被施加到上部构件的外周和下部构件的上周边，并且保护环围绕上部构件的外周和下部构件的上周边定位。 保护环最初是以提供机械稳定性和可加工性的尺寸制造的。 然后将保护环加工成与衬底支撑应用的设计一致的最终尺寸的精确组合。

公开(公告)号：US20080314508A1

公开(公告)日：2008-12-25

申请号：US12230238

申请日：2008-08-26

申请人： Tony Ricci ,  Jim Tappan ,  Keith Comendant

发明人： Tony Ricci ,  Jim Tappan ,  Keith Comendant

IPC分类号： B32B38/10

CPC分类号： H01L21/76251 ,  H01L21/68757 ,  H01L21/68785

摘要： A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member, and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member. The protective ring is originally fabricated with dimensions that provide mechanical stability and workability. The protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application.