公开(公告)号：US09921465B2

公开(公告)日：2018-03-20

申请号：US15072164

申请日：2016-03-16

Applicant: Toppan Printing Co., Ltd.

Inventor： Shinpei Kondo ,  Norihito Fukugami

IPC: G03F1/22 ,  G03F1/24

CPC classification number: G03F1/24

Abstract: A reflective mask reducing reflection of out-of-band light. The reflective mask includes a light shielding frame formed in a mask region corresponding to a boundary region of a chip on a semiconductor substrate multiply exposed. The substrate of the light shielding frame includes a layer having a different refractive index or includes pores to change the path of incident out-of-band light to thereby suppress the out-of-band light from being reflected off the conductive film. The substrate also includes a layer having a different refractive index relative to out-of-band light reflected off the conductive layer. With the reflective mask of this configuration, influence on the wiring pattern dimension can be reduced and productivity of the semiconductors can be improved.