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公开(公告)号:US10901161B2
公开(公告)日:2021-01-26
申请号:US16131842
申请日:2018-09-14
申请人: Toyota Motor Engineering & Manufacturing North America, Inc. , University of Ottawa , Broadcom Inc.
发明人: Ercan M. Dede , Christopher Valdivia , Matthew Wilkins , Karin Hinzer , Philippe-Olivier Provost , Denis Masson , Simon Fafard
摘要: An optical power transfer device with an embedded active cooling chip is disclosed. The device includes a cooling chip made of a semiconductor material, and a first subassembly and a second subassembly mounted on the cooling chip. The cooling chip comprises at least one metallization layer on a portion of a first surface of the cooling chip, at least one inlet through a second surface of the cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. A cooling fluid flows through the one or more micro-channels. The first subassembly is mounted on the at least one metallization layer and comprises a laser. The second subassembly comprises a phototransducer configured to receive a laser beam from the laser.
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公开(公告)号:US20200091677A1
公开(公告)日:2020-03-19
申请号:US16131842
申请日:2018-09-14
申请人: Toyota Motor Engineering & Manufacturing North America, Inc. , University of Ottawa , Broadcom Inc.
发明人: Ercan M. Dede , Christopher Valdivia , Matthew Wilkins , Karin Hinzer , Philippe-Olivier Provost , Denis Masson , Simon Fafard
摘要: An optical power transfer device with an embedded active cooling chip is disclosed. The device includes a cooling chip made of a semiconductor material, and a first subassembly and a second subassembly mounted on the cooling chip. The cooling chip comprises at least one metallization layer on a portion of a first surface of the cooling chip, at least one inlet through a second surface of the cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. A cooling fluid flows through the one or more micro-channels. The first subassembly is mounted on the at least one metallization layer and comprises a laser. The second subassembly comprises a phototransducer configured to receive a laser beam from the laser.
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