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1.发明授权Electronic control device and method of manufacturing electronic control device 有权电子控制装置及电子控制装置制造方法公开(公告)号：US07667971B2
公开(公告)日：2010-02-23
申请号：US12153117
申请日：2008-05-14
IPC分类号： H05K7/20
CPC分类号： B62D5/0406 , H05K3/32 , H05K7/142 , H05K7/20854 , H05K2201/10166 , H05K2201/10295 , H05K2201/1059 , H05K2201/10962
摘要： Provided is an electronic control device, including: a housing (3) which includes opening portions at both end portions thereof and is made of insulating resin; a heat sink (5) attached to one of the end portions of the housing (3); a power device (2) provided to the heat sink (5); a circuit board (4) which is provided so as to be opposed to the heat sink (5) and formed with an electronic circuit including a control circuit for controlling the power device (2); and a plurality of first conductive plates (6) held in the housing (3), for electrically connecting the circuit board (4) with the power device (2), in which each of the plurality of first conductive plates (6) includes a press fit terminal (6bp) press-fitted into a through hole (4a) formed in the circuit board (4) to be bonded to the circuit board (4) on a surface opposed to the circuit board (4) and to be bonded to respective terminals of the power device (2) on a surface opposed to the heat sink (5). Accordingly, an electronic control device whose size and cost are reduced and whose electrical connection reliability is improved is obtained.
摘要翻译： 提供一种电子控制装置，包括：壳体（3），其在其两端部包括开口部分并由绝缘树脂制成; 附接到壳体（3）的一个端部的散热器（5）; 设置到所述散热器（5）的功率器件（2）; 电路板（4），其设置成与散热器（5）相对并形成有包括用于控制电力设备（2）的控制电路的电子电路; 以及保持在所述壳体（3）中的多个第一导电板（6），用于将所述电路板（4）与所述功率器件（2）电连接，其中所述多个第一导电板（6）中的每一个包括 压配合端子（6bp）压配合到形成在电路板（4）中的通孔（4a）中，以在与电路板（4）相对的表面上与电路板（4）接合，并与 在与散热器（5）相对的表面上的功率器件（2）的各个端子。 因此，获得了尺寸和成本降低并且电连接可靠性提高的电子控制装置。
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2.发明申请Electronic control device and method of manufacturing electronic control device 有权电子控制装置及电子控制装置制造方法公开(公告)号：US20090122489A1
公开(公告)日：2009-05-14
申请号：US12153117
申请日：2008-05-14
CPC分类号： B62D5/0406 , H05K3/32 , H05K7/142 , H05K7/20854 , H05K2201/10166 , H05K2201/10295 , H05K2201/1059 , H05K2201/10962
摘要： Provided is an electronic control device, including: a housing (3) which includes opening portions at both end portions thereof and is made of insulating resin; a heat sink (5) attached to one of the end portions of the housing (3); a power device (2) provided to the heat sink (5); a circuit board (4) which is provided so as to be opposed to the heat sink (5) and formed with an electronic circuit including a control circuit for controlling the power device (2); and a plurality of first conductive plates (6) held in the housing (3), for electrically connecting the circuit board (4) with the power device (2), in which each of the plurality of first conductive plates (6) includes a press fit terminal (6bp) press-fitted into a through hole (4a) formed in the circuit board (4) to be bonded to the circuit board (4) on a surface opposed to the circuit board (4) and to be bonded to respective terminals of the power device (2) on a surface opposed to the heat sink (5). Accordingly, an electronic control device whose size and cost are reduced and whose electrical connection reliability is improved is obtained.
摘要翻译： 提供一种电子控制装置，包括：壳体（3），其在其两端部包括开口部分并由绝缘树脂制成; 附接到壳体（3）的一个端部的散热器（5）; 设置到所述散热器（5）的功率器件（2）; 电路板（4），其设置成与散热器（5）相对并形成有包括用于控制电力设备（2）的控制电路的电子电路; 以及保持在所述壳体（3）中的多个第一导电板（6），用于将所述电路板（4）与所述功率器件（2）电连接，其中所述多个第一导电板（6）中的每一个包括 压配合端子（6bp）压配合到形成在电路板（4）中的通孔（4a）中，以在与电路板（4）相对的表面上与电路板（4）接合，并与 在与散热器（5）相对的表面上的功率器件（2）的各个端子。 因此，获得了尺寸和成本降低并且电连接可靠性提高的电子控制装置。
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公开(公告)号：US20080157680A1
公开(公告)日：2008-07-03
申请号：US11755074
申请日：2007-05-30
IPC分类号： H01J7/24
CPC分类号： H05K7/20509 , H05K3/308 , H05K3/32 , H05K3/328 , H05K7/20854 , H05K2201/10166 , H05K2201/10295 , H05K2201/105 , H05K2201/1059 , H05K2201/10962
摘要： An electronic control apparatus can be reduced in size and cost, and also improved in the reliability of electrical connection by eliminating certain parts such as a power board, etc. The apparatus includes a housing, a heat sink arranged in the housing, semiconductor switching elements mounted on the heat sink and having terminals, a circuit board arranged in opposition to the heat sink and having an electronic circuit formed thereon including a control circuit for controlling the semiconductor switching elements, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other. The individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, so that they are bonded to the individual terminals.
摘要翻译： 电子控制装置的尺寸和成本可以减小，并且通过消除诸如电源板等的某些部件来提高电连接的可靠性。该装置包括壳体，布置在壳体中的散热器，半导体开关元件 安装在散热器上并具有端子，电路板布置成与散热器相对并且具有形成在其上的电子电路，包括用于控制半导体开关元件的控制电路，以及多个导电板，电连接电路板和 半导体开关元件彼此。 各个导电板沿着半导体开关元件的各个端子引出的引出方向布置，从而它们被结合到各个端子。
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公开(公告)号：US20080158830A1
公开(公告)日：2008-07-03
申请号：US11764331
申请日：2007-06-18
IPC分类号： H05K7/20
CPC分类号： H05K7/20509 , H01L2924/0002 , H05K3/308 , H05K3/32 , H05K3/328 , H05K7/20854 , H05K2201/10166 , H05K2201/10295 , H05K2201/105 , H05K2201/1059 , H05K2201/10962 , H01L2924/00
摘要： An electronic control apparatus can be reduced in size and cost by eliminating certain component parts such as a power board, etc. The apparatus includes a housing, a heat sink, semiconductor switching elements having terminals and mounted on the heat sink, a circuit board arranged in opposition to the heat sink, conductive plates connecting between the circuit board and the semiconductor switching elements, and a cover receiving the semiconductor switching elements and the circuit board in cooperation with the heat sink. The conductive plates have the press-fit terminal portions press-fitted into the through holes in the circuit board, and the individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, and are bonded to the individual terminals.
摘要翻译： 电子控制装置的尺寸和成本可以通过消除诸如电源板等的某些部件而减小。该装置包括壳体，散热器，具有端子并安装在散热器上的半导体开关元件，布置在电路板上的电路板 与散热器相对，连接在电路板和半导体开关元件之间的导电板，以及与散热器协作接收半导体开关元件和电路板的盖。 导电板的压配端子部分压配合到电路板的通孔中，并且各个导电板沿着半导体开关元件的各个端子引出的引出方向排列，并且是 绑定到各个终端。
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公开(公告)号：US08363420B2
公开(公告)日：2013-01-29
申请号：US11755074
申请日：2007-05-30
IPC分类号： H01R9/00
CPC分类号： H05K7/20509 , H05K3/308 , H05K3/32 , H05K3/328 , H05K7/20854 , H05K2201/10166 , H05K2201/10295 , H05K2201/105 , H05K2201/1059 , H05K2201/10962
摘要： The apparatus includes a housing, a heat sink arranged in the housing, semiconductor switching elements mounted on the heat sink and having terminals, a circuit board arranged in opposition to the heat sink and having an electronic circuit formed thereon including a control circuit for controlling the semiconductor switching elements, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other. The individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, so that they are bonded to the individual terminals.
摘要翻译： 该装置包括壳体，布置在壳体中的散热器，安装在散热器上并具有端子的半导体开关元件，布置成与散热器相对的电路板，并且具有形成在其上的电子电路，包括控制电路， 半导体开关元件和将电路板和半导体开关元件彼此电连接的多个导电板。 各个导电板沿着半导体开关元件的各个端子引出的引出方向布置，从而它们被结合到各个端子。
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公开(公告)号：US07791888B2
公开(公告)日：2010-09-07
申请号：US11812433
申请日：2007-06-19
CPC分类号： B60R16/0239 , B29C65/08 , B29C65/16 , B29C65/1635 , B29C66/1142 , B29C66/50 , B29C66/542 , H01L2924/0002 , H05K5/0043 , B29C65/00 , H01L2924/00
摘要： An electronic control apparatus can be reduced in size and cost by eliminating certain parts such as a power board, etc. The apparatus includes a housing, a heat sink attached to one end of the housing, semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements. The heat sink is composed of a heat sink main body, and an anodized aluminum film formed at least on a surface of the heat sink main body at a side at which the power device is mounted thereon, and the heat sink main body has outer peripheral end faces arranged in opposition to inner wall surfaces of an opening portion of the housing.
摘要翻译： 通过消除诸如电源板等的某些部件，可以减小电子控制装置的尺寸和成本。该装置包括壳体，附接到壳体的一端的散热器，安装在散热器上的半导体开关元件， 布置成与散热器相对的电路板，以及电连接电路板和半导体开关元件的多个导电板。 散热器由散热器主体和阳极氧化铝膜构成，阳极氧化铝膜至少形成在散热器主体的安装有电力设备的一侧的表面上，散热器主体具有外周 与壳体的开口部的内壁面相对配置的端面。
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公开(公告)号：US20080278918A1
公开(公告)日：2008-11-13
申请号：US11934448
申请日：2007-11-02
CPC分类号： B62D5/0406 , H01L2924/0002 , H05K7/2049 , H05K7/20854 , H01L2924/00
摘要： An electronic control apparatus can be reduced in size and cost by removing a metal substrate part. The apparatus includes a housing having a pair of opening portions at its opposite sides, a heat sink attached to one of the opening portions of the housing, a pair of semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other, and a plate spring urging the semiconductor switching elements against the heat sink. The plate spring has engagement portions press-fitted to and engaged with inner sides of holding portions which are formed on the housing, and the housing has engagement portions engaged with protruded portions of the heat sink.
摘要翻译： 通过去除金属基板部件，可以减小电子控制装置的尺寸和成本。 该装置包括：壳体，其相对侧具有一对开口部分，安装在壳体的一个开口部分上的散热片，安装在散热片上的一对半导体开关元件，与该散热片相对布置的电路板 散热器，将电路板和半导体开关元件彼此电连接的多个导电板以及迫使半导体开关元件抵靠散热器的板簧。 板簧具有压配合并与形成在壳体上的保持部的内侧接合的接合部，并且壳体具有与散热器的突出部接合的接合部。
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公开(公告)号：US07751193B2
公开(公告)日：2010-07-06
申请号：US11764331
申请日：2007-06-18
CPC分类号： H05K7/20509 , H01L2924/0002 , H05K3/308 , H05K3/32 , H05K3/328 , H05K7/20854 , H05K2201/10166 , H05K2201/10295 , H05K2201/105 , H05K2201/1059 , H05K2201/10962 , H01L2924/00
摘要： An electronic control apparatus can be reduced in size and cost by eliminating certain component parts such as a power board, etc. The apparatus includes a housing, a heat sink, semiconductor switching elements having terminals and mounted on the heat sink, a circuit board arranged in opposition to the heat sink, conductive plates connecting between the circuit board and the semiconductor switching elements, and a cover receiving the semiconductor switching elements and the circuit board in cooperation with the heat sink. The conductive plates have the press-fit terminal portions press-fitted into the through holes in the circuit board, and the individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, and are bonded to the individual terminals.
摘要翻译： 电子控制装置的尺寸和成本可以通过消除诸如电源板等的某些部件而减小。该装置包括壳体，散热器，具有端子并安装在散热器上的半导体开关元件，布置在电路板上的电路板 与散热器相对，连接在电路板和半导体开关元件之间的导电板，以及与散热器协作接收半导体开关元件和电路板的盖。 导电板的压配端子部分压配合到电路板的通孔中，并且各个导电板沿着半导体开关元件的各个端子引出的引出方向排列，并且是 绑定到各个终端。
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公开(公告)号：US07643297B2
公开(公告)日：2010-01-05
申请号：US11934448
申请日：2007-11-02
IPC分类号： H05K7/20
CPC分类号： B62D5/0406 , H01L2924/0002 , H05K7/2049 , H05K7/20854 , H01L2924/00
摘要： An electronic control apparatus can be reduced in size and cost by removing a metal substrate part. The apparatus includes a housing having a pair of opening portions at its opposite sides, a heat sink attached to one of the opening portions of the housing, a pair of semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other, and a plate spring urging the semiconductor switching elements against the heat sink. The plate spring has engagement portions press-fitted to and engaged with inner sides of holding portions which are formed on the housing, and the housing has engagement portions engaged with protruded portions of the heat sink.
摘要翻译： 通过去除金属基板部件，可以减小电子控制装置的尺寸和成本。 该装置包括：壳体，其相对侧具有一对开口部分，安装在壳体的一个开口部分上的散热片，安装在散热片上的一对半导体开关元件，与该散热片相对布置的电路板 散热器，将电路板和半导体开关元件彼此电连接的多个导电板以及迫使半导体开关元件抵靠散热器的板簧。 板簧具有压配合并与形成在壳体上的保持部的内侧接合的接合部，并且壳体具有与散热器的突出部接合的接合部。
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公开(公告)号：US20080158823A1
公开(公告)日：2008-07-03
申请号：US11812433
申请日：2007-06-19
IPC分类号： H05K7/20
CPC分类号： B60R16/0239 , B29C65/08 , B29C65/16 , B29C65/1635 , B29C66/1142 , B29C66/50 , B29C66/542 , H01L2924/0002 , H05K5/0043 , B29C65/00 , H01L2924/00
摘要： An electronic control apparatus can be reduced in size and cost by eliminating certain parts such as a power board, etc. The apparatus includes a housing, a heat sink attached to one end of the housing, semiconductor switching elements 2 mounted on the heat sink, a circuit board arranged in opposition to the heat sink, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements. The heat sink is composed of a heat sink main body, and an anodized aluminum film formed at least on a surface of the heat sink main body at a side at which the power device is mounted thereon, and the heat sink main body has outer peripheral end faces arranged in opposition to inner wall surfaces of an opening portion of the housing.
摘要翻译： 通过消除诸如电源板等的某些部件，可以减小电子控制装置的尺寸和成本。该装置包括壳体，附接到壳体的一端的散热器，安装在散热器上的半导体开关元件2， 布置成与散热器相对的电路板，以及电连接电路板和半导体开关元件的多个导电板。 散热器由散热器主体和阳极氧化铝膜构成，阳极氧化铝膜至少形成在散热器主体的安装有电力设备的一侧的表面上，散热器主体具有外周 与壳体的开口部的内壁面相对配置的端面。
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