公开(公告)号：US20160126688A1

公开(公告)日：2016-05-05

申请号：US14932315

申请日：2015-11-04

申请人： Tyco Electronics Corporation ,  Tyco Electronics Raychem GMBH

发明人： Adam Kohn ,  Ladislaus Kehl ,  Ankur Gupta ,  Kaitlyn E. Mawhinney ,  Timothy F. Poirier

IPC分类号： H01R43/28 ,  C09D135/04 ,  C09D5/24

CPC分类号： H01R43/28 ,  C08F222/32 ,  C09D4/00 ,  C09D5/24 ,  C09D135/04

摘要： A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.