公开(公告)号：US20230080167A1

公开(公告)日：2023-03-16

申请号：US17946080

申请日：2022-09-16

Applicant: Tyco Electronics Japan G.K.

Inventor： Naoki Hashimoto ,  Masashi Inoue

IPC: H01R13/64 ,  H01R13/24 ,  H01R12/71 ,  H01R12/70

Abstract: A socket includes a housing with a bottom plate portion and a frame body portion standing at edges of the bottom plate portion and extending along the edges. The frame body portion serves as a locator in an in-plane direction of the bottom plate portion in mounting an electronic component. The bottom plate portion and the frame body portion are integrally molded into the housing. The socket includes a plurality of contacts supported by the bottom plate portion. The socket includes a spring member including a supported portion supported by a first side of the frame body portion and a spring portion that elastically deforms by being pushed by the electronic component, pressing the electronic component against a second side opposite to the first side.